IP Library Granted Patent US 8,535,974
Granted Patent B2
US 8,535,974 · App. 13/175,714 · Granted Sep 17, 2013

Hole transport compositions and related devices and methods (II)

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Quick Facts
Patent No.
US 8,535,974
App. No.
13/175,714
Granted
Sep 17, 2013
Kind
B2
Abstract

A composition comprising: at least one compound comprising a hole transporting core, wherein the core is covalently bonded to a first arylamine group and also covalently bonded to a second arylamine group different from the first, and wherein the compound is covalently bonded to at least one intractability group, wherein the intractability group is covalently bonded to the hole transporting core, the first arylamine group, the second arylamine group, or a combination thereof, and wherein the compound has a molecular weight of about 5,000 g/mole or less. Blended mixtures of arylamine compounds, including fluorene core compounds, can provide good film formation and stability when coated onto hole injection layers. Solution processing of OLEDs is a particularly important application.

Claims (40)

1. A method comprising:

providing a substrate comprising a hole injection layer,

coating the substrate with at least one ink comprising at least one hole transport arylamine compound comprising intractability groups to form a coated substrate,

heating the coated substrate.

2. The method of claim 1 , wherein the ink is subjected to pre-crosslinking before coating the ink on the substrate.

3. The method of claim 1 , wherein the ink is subjected to thermal pre-crosslinking before coating the ink on the substrate.

4. The method of claim 1 , wherein the ink is subjected to thermal pre-crosslinking to form a gel before coating the ink on the substrate.

5. The method of claim 1 , wherein the ink is subjected to thermal pre-crosslinking at at least 150° C. to form a gel before coating the ink on the substrate.

6. The method of claim 1 , wherein the ink is subjected to UV light pre-crosslinking before coating the ink on the substrate.

7. The method of claim 1 , wherein the coated substrate is subjected to UV light to induce pre-crosslinking before heating the coated substrate.

8. The method of claim 1 , wherein the coated substrate is heated to at least 200° C.

9. The method of claim 1 , wherein the coated substrate is heated to at least 250° C.

10. The method of claim 1 , wherein after heating the coated substrate shows a uniform defect free continuous film coated on top of a substrate coated with hole injection layer in the optical microscope.

11. The method of claim 1 , wherein after heating the coated substrate shows a uniform defect free continuous film coated on top of a substrate coated with a non-aqueous hole injection layer in the optical microscope.

12. The method of claim 1 , wherein after heating the coated substrate is stable to toluene solvent wash so that retains at least 90% of initial thickness after toluene is spun on the substrate for one minute and then dried for five minutes at 100° C.

13. The method of claim 1 , wherein after heating the coated substrate is stable to toluene solvent wash so that retains at least 95% of initial thickness after toluene is spun on the substrate for one minute and then dried for five minutes at 100° C.

14. The method of claim 1 , wherein the coating of the coated substrate before crosslinking shows a Tg of 200° C. or less.

15. The method of claim 1 , wherein the coating of the coated substrate before crosslinking shows a Tg of 150° C. or less.

16. The method of claim 1 , wherein the hole injection layer is an aqueous hole injection layer.

17. The method of claim 1 , wherein the hole injection layer is a non-aqueous hole injection layer.

18. The method of claim 1 , wherein the hole injection layer comprises a polymer.

19. The method of claim 1 , wherein the hole injection layer comprises a conjugated polymer.

20. The method of claim 1 , wherein the hole injection layer comprises a polythiophene.

21. The method of claim 1 , wherein the hole injection layer comprises a polythiophene comprising at least one alkoxy substituent.

22. The method of claim 1 , wherein the hole injection layer comprises a sulfonated polythiophene.

23. The method of claim 1 , wherein the hole injection layer comprises a polymeric arylamine.

24. The method of claim 1 , wherein the hole injection layer comprises a regioregular polythiophene.

25. The method of claim 1 , wherein the hole injection layer comprises a conjugated polymer which is soluble in water.

26. The method of claim 1 , wherein the hole injection layer comprises a conjugated polymer which is soluble in organic solvent.

27. The method of claim 1 , further comprising the step of coating an emitting layer on the coated substrate.

28. The method of claim 1 , wherein the ink comprises at least two hole transport materials comprising intractability groups.

29. The method of claim 1 , wherein the ink comprises at least two hole transport materials each comprising a different intractability group.

30. The method of claim 1 , wherein the ink comprises a composition comprising: at least one first compound and at least one second compound different from the first, wherein the at least one first compound comprises a hole transporting core which is a fluorene core, wherein the hole transporting core is covalently bonded to a first arylamine group and also covalently bonded to a second arylamine group, and wherein the core is further covalently bonded to at least two solubilizing groups comprising at least four carbon atoms, and wherein the solubilizing groups are optionally substituted with intractability groups; wherein the at least one second compound comprises a hole transporting core which is a fluorene core, wherein the hole transporting core is covalently bonded to a first arylamine group and also covalently bonded to a second arylamine group, wherein the second compound further comprises at least one intractability group which may be bonded to the first arylamine group, the second arylamine group, or both; and wherein the first and second compounds have molecular weight of about 5,000 g/mole or less.

31. The method of claim 1 , wherein the ink comprises a composition comprising: at least one compound comprising a hole transporting core, wherein the core is covalently bonded to a first arylamine group and also covalently bonded to a second arylamine group, and wherein the compound is covalently bonded to at least one intractability group, wherein the intractability group is covalently bonded to the hole transporting core, the first arylamine group, the second arylamine group, or a combination thereof, and wherein the compound has a molecular weight of about 5,000 g/mole or less.

32. The method of claim 1 , wherein the compound is a first compound, and the composition further comprises at least one additional second compound, different from the first compound, which activates a polymerization reaction for the composition.

33. The method of claim 1 , wherein the compound is a first compound, and the composition further comprises at least one additional second compound, different from the first compound, which comprises para-styrene units.

34. The method of claim 1 , wherein the compound is a first compound, and the composition further comprises at least one additional second arylamine compound, different from the first arylamine compound, wherein the second arylamine compound has only one crosslinking group.

35. The method of claim 1 , wherein the compound is a first compound, and the composition further comprises at least one second arylamine compound, different from the first arylamine compound, wherein the second arylamine compound has three or more crosslinking groups.

36. The method of claim 1 , wherein the compound is a first compound, and the composition further comprises at least one second arylamine compound, wherein the second arylamine compound has a lower LUMO and lower or similar HOMO compared to the first and compound.

37. The method of claim 1 , wherein the intractability groups are polymerizable groups.

Assignments (9)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 16, 2016
From: SOLVAY USA, INC.
To: NISSAN CHEMICAL INDUSTRIES, LTD.
Reel/Frame 039767/0225 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0641 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0619 →
RELEASE OF SECURITY INTEREST Recorded Mar 31, 2014
From: SOLVAY AMERICA, INC.
To: PLEXTRONICS, INC.
Reel/Frame 032568/0742 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 31, 2014
From: PLEXTRONICS, INC.
To: SOLVAY USA INC.
Reel/Frame 032568/0780 →
SECURITY AGREEMENT Recorded Jan 30, 2014
From: PLEXTRONICS, INC.
To: SOLVAY AMERICA, INC.
Reel/Frame 032141/0680 →
SECURITY AGREETMENT Recorded Sep 23, 2013
From: PLEXTRONICS, INC.
To: SOLVAY AMERICA, INC.
Reel/Frame 031347/0336 →
SECURITY AGREEMENT Recorded May 24, 2013
From: PLEXTRONICS, INC.
To: SOLVAY AMERICA, INC.
Reel/Frame 030486/0137 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2011
From: BROWN, CHRISTOPHER T.; CHOPRA, NEETU; KNITTEL, CHRISTOPHER; MATHAI, MATHEW; SESHADRI, VENKATARAMANAN; WANG, JING; WOODWORTH, BRIAN
To: PLEXTRONICS, INC.
Reel/Frame 026849/0910 →