Selective plating fixture
View Patent ↗A plating fixture that affords improved control and process repeatability of the placement of material on a surface of a terminal lead is described. The thereby plated terminal lead is further incorporatable into an electrochemical cell. The plating fixture consists of a membrane that prevents migration of the electroplating chemicals along areas of the lead that are not desired. Furthermore, the fixture utilizes a setup plate that controls the length of the lead that is plated.
1. An electroplating fixture assembly for plating a terminal lead, the fixture assembly comprising:
a) a main body extending along a longitudinal axis having a depth that extends from a base aligned substantially perpendicular from the longitudinal axis, the base having a bottom surface;
b) a membrane having a membrane depth that extends perpendicularly from the longitudinal axis, the membrane residing along the base bottom surface of the main body so that the membrane depth is aligned along the longitudinal axis;
c) a pedestal positionable below both the base bottom surface of the main body and the membrane along the longitudinal axis, wherein the pedestal has at least one pedestal well extending from an open well end to a bottom well wall part way through a depth of the pedestal and wherein the pedestal open well end is positionable adjacent the membrane; and
d) wherein a terminal lead having a terminal lead length extending from a proximal terminal lead end to a distal terminal lead end is positionable within the main body so that the terminal lead length is oriented perpendicular to the longitudinal axis through the depth of the membrane, wherein the proximal terminal lead end resides above a top membrane surface and the distal terminal lead end extends beyond a membrane bottom surface.
2. The electroplating fixture assembly of claim 1 wherein the pedestal resides on a surface of a setup plate, wherein the setup plate is contactable to the base bottom surface of the main body so that the pedestal open well end is adjacent the membrane bottom surface.
3. The electroplating fixture assembly of claim 1 wherein a distance between a pedestal bottom well surface and the membrane bottom surface determines the length of a plated portion of the terminal lead.
4. The electroplating fixture assembly of claim 1 further comprising at least one electrode rod positioned within the main body and electrically contactable with the terminal lead.
5. The electroplating fixture assembly of claim 4 wherein the electrode rod electrically connectable to an electrical power source.
6. The electroplating fixture assembly of claim 1 wherein a demarcation line, positioned parallel to the longitudinal axis of the main body, extends around a perimeter of the terminal lead delineating a plated lead surface portion from a non-plated lead surface portion.
7. The electroplating fixture assembly of claim 1 wherein the membrane resides within a cavity within the base bottom surface of the main body.
8. The electroplating fixture assembly of claim 1 is configured to plate a metal selected from the group consisting of gold, nickel, silver, platinum, and palladium on an exterior surface of the terminal lead.
9. The electroplating fixture assembly of claim 1 wherein a releasable clamp secures the membrane along the base bottom surface of the main body.
10. The electroplating fixture assembly of claim 1 wherein a support plate secures the membrane along the base bottom surface of the main body.
11. The electroplating fixture assembly of claim 1 wherein a plurality of terminal leads is positionable within the fixture.
12. The electroplating fixture assembly of claim 1 wherein the plated terminal lead is configured for subsequent incorporation into an electrochemical cell.
13. An electroplating fixture assembly for plating a terminal lead, the fixture comprising:
a) a main body extending along a longitudinal axis having a depth that extends from a base aligned substantially perpendicular from the longitudinal axis, the base having a bottom surface;
b) a membrane having a membrane depth extending perpendicular from the longitudinal axis, the membrane residing along the base bottom surface of the main body so that the membrane depth is aligned along the longitudinal axis;
c) a setup plate contactable to the base bottom surface of the main body, wherein a pedestal resides on a surface of the setup plate, the pedestal having at least one pedestal well extending from an open well end to a bottom well wall part way through a depth of the pedestal and wherein the pedestal open well end is positionable adjacent the membrane; and
d) wherein a terminal lead having a terminal lead length extending from a proximal terminal lead end to a distal terminal lead end is positionable within the main body so that the terminal lead length is oriented perpendicular to the longitudinal axis through the membrane depth, wherein the proximal terminal lead end resides above a membrane top surface and the distal terminal lead end extends beyond a membrane bottom surface.
14. The electroplating fixture assembly of claim 13 further comprising at least one electrode rod positioned within the main body, the electrode rod electrically contactable with the terminal lead and an electrical power source.
15. The electroplating fixture assembly of claim 13 wherein a distance between the pedestal bottom well surface and the membrane bottom surface determines the length of a plated portion of the terminal lead.
16. The electroplating fixture assembly of claim 13 is configured to plate a metal selected from the group consisting of gold, nickel, silver, platinum, and palladium on a surface of the terminal lead.
17. The electroplating fixture assembly of claim 13 wherein the membrane resides within a cavity within the base bottom surface of the main body.
18. The electroplating fixture assembly of claim 13 wherein a releasable clamp secures the membrane along the base bottom surface of the main body.
19. The electroplating fixture assembly of claim 13 wherein the plated terminal lead is configured for subsequent incorporation into an electrochemical cell.