A temporary part is fixed to a base by using an adhesive layer to which fillers are mixed at a predetermined density. When the temporary part is heated, heat is applied to the fillers and the adhesive layer. At a temperature equal to or higher than the glass-transition temperature of the adhesive agent, the heated adhesive layer is thermally contracted so as to release remaining stress, and on the other hand, the heated fillers are thermally expanded. In this manner, the peel-off strength between the adhesive layer and the base (or the temporary part) is reduced, and the disassembly is facilitated.
1. A pipe module comprising:
a pipe; a temporary part for holding the pipe at a position; and a base to which the pipe and the temporary part are held,
wherein the temporary part and the base are adhered to each other by an adhesive layer formed of an adhesive agent to which a filler is added, the adhesive agent being a two-component cold-setting epoxy adhesive agent or a two-component cold-setting acrylic adhesive agent having an elastic modulus at 25° C. is 0.1 GPa or higher, the adhesive layer being configured to have the properties that, by application of heat, the filler is thermally expanded, the adhesive layer is thermally contracted and space is generated between the adhesive layer and the temporary part or between the adhesive layer and the base by the application of heat.
2. The pipe module according to claim 1 ,
wherein the filler has a diameter of 150 μm or more.
3. The pipe module according to claim 1 ,
wherein the adhesive layer is configured to have the property that the application of heat causes glass transition of the adhesive agent.
4. The pipe module according to claim 2 ,
wherein the filler has a diameter up to 3 mm.
5. The pipe module according to claim 1 ,
wherein the filler has an elastic modulus at 25° C. higher than that of the adhesive agent by one or more orders of magnitude.
6. The pipe module according to claim 1 ,
wherein the filler is selected from the group consisting of alumina, zirconia, mullite, silicon nitride, silicon carbide, soda glass, borosilicate glass, silica, silicon and metals containing copper, zinc or aluminum as main components.