Package for light emitting device
A semiconductor light emitting package is discussed, which includes a base having a top surface with a flat portion; a semiconductor light emitting device on the base; an electrical circuit layer electrically connected to the semiconductor light emitting device; a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough, wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device, an edge portion of the optical member is in contact with the screen member, a top surface of the optical member is substantially parallel to the flat portion of the base.
1. A semiconductor light emitting package, comprising:
a base having a top surface with a flat portion;
a semiconductor light emitting device on the base;
an electrical circuit layer electrically connected to the semiconductor light emitting device;
a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and
an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough,
wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device,
an edge portion of the optical member is in contact with the screen member,
a top surface of the optical member is substantially parallel to the flat portion of the base.
2. The semiconductor light emitting package according to claim 1 , wherein a perimeter of the optical member is substantially the same as a perimeter of the screen member.
3. The semiconductor light emitting package according to claim 1 , further comprising an electrode layer disposed on the base.
4. The semiconductor light emitting package according to claim 1 , wherein the optical member is formed of a resin material.
5. The semiconductor light emitting package according to claim 1 , further comprising a heat sink combined with the base.
6. The semiconductor light emitting package according to claim 1 , wherein the base is formed of a metal.
7. A light emitting unit, comprising:
at least one semiconductor light emitting package, each including:
a base having a top surface with a flat portion;
a semiconductor light emitting device on the base;
an electrical circuit layer electrically connected to the semiconductor light emitting device;
a screen member having an opening and disposed on the base around the semiconductor light emitting device, the screen member shaped into a substantially circle; and
an optical member formed of a light transmissive material such that light emitted from the semiconductor light emitting device passes therethrough,
wherein a bottom surface of the screen member is positioned higher than the semiconductor light emitting device,
an edge portion of the optical member is in contact with the screen member,
a top surface of the optical member is substantially parallel to the flat portion of the base.
8. The light emitting unit according to claim 7 , wherein a perimeter of the optical member is substantially the same as a perimeter of the screen member.
9. The light emitting unit according to claim 7 , further comprising an electrode layer disposed on the base.
10. The light emitting unit according to claim 7 , wherein the optical member is formed of a resin material.
11. The light emitting unit according to claim 7 , further comprising a heat sink combined with the base.
12. The light emitting unit according to claim 7 , wherein the base is formed of a metal.