Method of assembling a thermal expansion compensator
View Patent ↗A thermal expansion compensator is provided and includes a first electrode structure having a first surface, a second electrode structure having a second surface facing the first surface and an elastic element bonded to the first and second surfaces and including a conductive element by which the first and second electrode structures electrically and/or thermally communicate, the conductive element having a length that is not substantially longer than a distance between the first and second surfaces.
1. A method of assembling a thermal expansion compensator, the method comprising:
disposing coils with pins inserted therein on a first foil layer disposed on a first electrode;
disposing a second foil layer and then a second electrode on the pins and the coils;
loading and then bonding the coils to the first and second foil layers and the first and second foil layers to the first and second electrodes to form an assembly; and
removing the pins.
2. The method according to claim 1 , further comprising compressing the assembly in a direction perpendicular to a longitudinal direction of the coils to achieve a coil compression.
3. The method according to claim 1 , wherein the coils comprise molybdenum (Mo), the first and second foil layers comprise titanium (Ti) and the first and second electrodes comprise molybdenum (Mo).
4. The method according to claim 1 , wherein the bonding comprises bonding at about 760 degrees Celsius for about 120 minutes.
5. The method according to claim 1 , further comprising performing a second bonding operation following the removing of the pins to increase the bonding between the coils and the first and second foils layers and between the first and second foil layers to the first and second electrodes.
6. The method according to claim 5 , wherein the performing of the second bonding operation comprises inserting second pins to tightly fit within the coils.