IP Library Granted Patent US 8,378,568
Granted Patent B2
US 8,378,568 · App. 13/183,176 · Granted Feb 19, 2013

White light emitting diode with yellow, green and red light emitting phosphors

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Quick Facts
Patent No.
US 8,378,568
App. No.
13/183,176
Granted
Feb 19, 2013
Kind
B2
Abstract

Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

Claims (11)

1. A white light emitting diode (LED) comprising:

a blue LED chip; and

yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light;

wherein the yellow light emitting phosphor is a silicate-based phosphor,

wherein the green light emitting phosphor is a silicate-based phosphor composed of (Ba, Sr, Ca, Mg)2SiO4:Eu, Re or a sulfide-based phosphor composed of (Sr, Ca)Ga2S4:Eu, Re,

wherein the red light emitting phosphor is a nitride-based phosphor composed of (Sr, Ca, Ba)AlSiN:Eu, Re,

wherein the Eu represents a basic doping, Re represents rare earth co-doping and the mixing ratio of the yellow, green, and red light emitting phosphors is set in the range of: 0.5≦yellow light emitting phosphors<1, 0.01≦green light emitting phosphors<0.4, and 0.01<red light emitting phosphors<0.1 (here, yellow light emitting phosphors+green light emitting phosphors+red light emitting phosphors=1).

2. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are mixed and scattered.

3. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are sequentially laminated in the form of layer.

4. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are mixed with a molding material and are then coated.

5. The white LED according to claim 4 , wherein the molding material is formed of any one selected from the group consisting of silicon, hybrid, epoxy, and polyvinyl-based resin.

Assignments (1)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →