IP Library › Patent Application 13183196
Patent Application
App. No. 13/183,196

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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Quick Facts
Patent No.
US None
App. No.
13/183,196
Abstract

Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

Claims (6)

1 - 2 . (canceled)

3 . A method of manufacturing a semiconductor device, comprising the steps of:

flip-chip-bonding a semiconductor chip via a bump over a wiring substrate;

supplying O 2 plasma in a gap of the wiring substrate and the semiconductor chip after the step of flip-chip-bonding; and

pouring under-filling resin in the gap of the wiring substrate and the semiconductor chip after the step of supplying O 2 plasma.

4 - 15 . (canceled)