IP Library Granted Patent US 9,001,475
Granted Patent B2
US 9,001,475 · App. 13/184,187 · Granted Apr 7, 2015

Thermal shutdown unit, switch controller including the same, and control method of thermal shutdown protection operation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,001,475
App. No.
13/184,187
Granted
Apr 7, 2015
Kind
B2
Abstract

The present invention relates to a thermal shutdown unit, a switch controller including the same, and a method controlling a thermal shutdown protection operation. The present invention determines the operation state of an SMPS to vary a reference temperature for controlling a thermal shutdown protection operation according to an operation state of the SMPS.

Claims (66)

1. A method of controlling a thermal shutdown protection operation of a controller controlling an operation of an SMPS, comprising:

determining whether the SMPS is in an overload state;

determining whether the SMPS is in a start-up state in which the SMPS starts to be operated; and

varying a reference temperature to control the thermal shutdown protection operation of the controller according to a result of the determination of whether the SMPS is in the overload state and a result of the determination of whether the SMPS is in the start-up state,

wherein the variation of the reference temperature includes

setting up the reference temperature corresponding to the overload state as a temperature that is lower than the reference temperature corresponding to the start-up state.

2. The method of claim 1 , further comprising determining whether the SMPS is in a protection state in which a power source voltage for the operation of the controller is decreased such that a switching operation of the power switch controlling the operation of the SMPS is not generated,

wherein the variation of the reference temperature is according to the result of the determination of whether the SMPS is in the overload state, the result of the determination of whether the SMPS is in the start-up state, and a result of the determination of whether the SMPS is in the protection state.

3. The method of claim 2 , wherein, in the variation of the reference temperature, the reference temperature corresponding to the overload state is set up as the temperature that is lower than the reference temperature corresponding to the start-up state and the reference temperature corresponding to the protection state.

4. The method of claim 2 , wherein the variation of the reference temperature includes:

setting up the reference temperature as a first reference temperature when an operation state of the SMPS is a normal state;

setting up the reference temperature as a second reference temperature when the operation state of the SMPS is the start-up state;

setting up the reference temperature as a third temperature when the operation state of the SMPS is the overload state; and

setting up the reference temperature as a fourth temperature when the operation state of the SMPS is the protection state,

wherein the first reference temperature is lower than the second and fourth reference temperatures and higher than the third reference temperature.

5. The method of claim 1 , wherein the determination of whether the SMPS is in the overload state includes determining an overload by using a feedback voltage corresponding to an output voltage of the SMPS.

6. The method of claim 1 , wherein the determination of whether the SMPS is in the start-up state includes sensing a power source voltage for the operation of the controller.

7. The method of claim 1 , wherein the variation of the reference temperature includes:

setting up the reference temperature as a first reference temperature when an operation state of the SMPS is normal state;

setting up the reference temperature as a second reference temperature when the operation state of the SMPS is the start-up state; and

setting up the reference temperature as a third temperature when the operation state of the SMPS is the overload state as,

wherein the first reference temperature is lower than the second reference temperature and higher than the third reference temperature.

8. A thermal shutdown unit controlling a thermal shutdown protection operation of a controller controlling an operation of an SMPS, comprising;

at least one diode;

a shutdown comparator comparing a temperature sensing voltage generated in the at least one diode with a thermal shutdown reference voltage to control the thermal shutdown protection operation; and

a thermal shutdown reference voltage selection circuit outputting the thermal shutdown reference voltage and varying the thermal shutdown reference voltage according to an operation state of the SMPS,

wherein the temperature sensing voltage is varied according to heat generated in the controller, the operation state of the SMPS includes an overload state and a start-up state, the thermal shutdown reference voltage selection circuit sets the thermal shutdown reference voltage to a third thermal shutdown reference voltage when the SMPS is in the overload state and to a second thermal shutdown reference voltage when the SMPS is in the start-up state, and the third thermal shutdown reference voltage indicates a temperature that is lower than a temperature indicated by the second thermal shutdown reference voltage.

9. The thermal shutdown unit of claim 8 , wherein the operation state of the SMPS further includes a protection state in which a power source voltage for the operation of the controller is decreased such that a switching operation of the power switch controlling the operation of the SMPS is not generated.

10. The thermal shutdown unit of claim 9 , wherein the thermal shutdown reference voltage corresponding to a normal state is different from the thermal shutdown reference voltage corresponding to the start-up state, the protection state, or the overload state.

11. The thermal shutdown unit of claim 8 , wherein the thermal shutdown reference voltage corresponding to the normal state is different from the thermal shutdown reference voltage corresponding to the start-up state and the thermal shutdown reference voltage corresponding to the overload state.

12. The thermal shutdown unit of claim 11 , wherein the thermal shutdown reference voltage corresponding to the overload state is different from the thermal shutdown reference voltage corresponding to the start-up state.

13. The thermal shutdown unit of claim 12 , wherein the temperature sensing voltage is decreased as a temperature of the controller is increased.

14. The thermal shutdown unit of claim 8 , wherein the thermal shutdown reference voltage selection circuit comprises:

an overload sensing unit sensing the overload state by using a feedback voltage corresponding to an output voltage of the SMPS;

a start-up sensing unit sensing the start-up state by using a power source voltage for the operation of the controller; and

a reference voltage selector selecting a first thermal shutdown reference voltage when the SMPS is in a normal state, the second thermal shutdown reference voltage when the SMPS is in the start-up state, or the third thermal shutdown reference voltage when the SMPS is in the overload state.

15. The thermal shutdown unit of claim 14 , wherein the overload sensing unit includes:

a first comparator generating an output signal according to a result of comparing the feedback voltage with a predetermined overload reference voltage to determine whether the SMPS is in the overload state;

a counter generating a first controlling signal if a predetermined first delay period is counted from a time that the overload state is generated; and

an overload latch operating the counter in synchronization with the output signal of the first comparator,

the feedback voltage is higher than the overload reference voltage if the overload state is generated.

16. The thermal shutdown unit of claim 15 , wherein the start-up sensing unit comprises a second counter generating a second controlling signal if the predetermined second delay period is counted from a time that the power source voltage is increased to a voltage level for the operation of the controller.

17. The thermal shutdown unit of claim 16 , wherein the reference voltage selector selects the third thermal shutdown reference voltage according to the first controlling signal and the second thermal shutdown reference voltage according to the second controlling signal.

18. The thermal shutdown unit of claim 17 , wherein the reference voltage selector comprises:

a first transmission gate having an input terminal input with the first thermal shutdown reference voltage, a first control terminal input with the first controlling signal, a second control terminal input with a first inversion controlling signal of which the first controlling signal is inverted, and an output terminal;

a second transmission gate having an input terminal input with the third thermal shutdown reference voltage, a first control terminal input with the first inversion controlling signal, a second control terminal input with the first controlling signal, and an output terminal; and

a third transmission gate having an input terminal connected to the output terminal of the first and second transmission gates, the first control terminal input with the second inversion controlling signal of which the second controlling signal is inverted, the second control terminal input with the second controlling signal, and an output terminal connected to the input terminal of the shutdown comparator.

19. The thermal shutdown unit of claim 18 , wherein the reference voltage selector further comprises:

a fourth transmission gate having an input terminal input with the second thermal shutdown reference voltage, the first control terminal input with the second controlling signal, a second control terminal input with the second inversion controlling signal, and an output terminal connected to one input terminal of the shutdown comparator.

20. The thermal shutdown unit of claim 19 , wherein the shutdown comparator comprises:

one input terminal connected to the output terminal of the third and fourth transmission gates; and

the other input terminal input with the temperature sensing voltage.

21. A switch controller controlling a switching operation of a power switch controlling an operation of an SMPS, comprising:

a PWM controller controlling turn-off of a power switch according to a feedback voltage corresponding to an output voltage and a sensing voltage corresponding to a current flowing through the power switch, and turning on the power switch according to a clock signal determining a switching frequency of the power switch; and

a thermal shutdown unit varying a thermal shutdown reference voltage controlling a thermal shutdown protection operation of the switch controller according to an operation state of the SMPS, and generating a thermal shutdown signal and transmitting it the thermal shutdown signal to the PWM controller if a temperature sensing voltage corresponding to a temperature of the switch controller reaches the thermal shutdown reference voltage,

wherein the PWM controller turns off the power switch according to the thermal shutdown signal, and the thermal shutdown unit sets the thermal shutdown reference voltage to a third thermal shutdown reference voltage when the SMPS is in an overload state and to a second thermal shutdown reference voltage when the SMPS is in a start-up state, and the third thermal shutdown reference voltage indicates a temperature that is lower than a temperature indicated by the second thermal shutdown reference voltage.

22. The switch controller of claim 21 , wherein the thermal shutdown unit comprises:

at least one diode of which the temperature sensing voltage is generated;

a shutdown comparator comparing the temperature sensing voltage with the thermal shutdown reference voltage to control the thermal shutdown protection operation; and

a thermal shutdown reference voltage selection circuit outputting the thermal shutdown reference voltage and changing the thermal shutdown reference voltage according to the operation state of the SMPS,

wherein the temperature sensing voltage is varied according to heat generated in the controller, and the operation state of the SMPS includes an overload state and a start-up state.

23. The switch controller of claim 22 , wherein the operation state of the SMPS further includes a protection state in which a power source voltage for the operation of the controller is decreased such that the switching operation of the power switch controlling the operation of the SMPS is not generated.

24. The switch controller of claim 23 , wherein a thermal shutdown reference voltage corresponding to a normal state is different from the thermal shutdown reference voltage corresponding to the start-up state, the protection state, or the overload state.

25. The switch controller of claim 24 , wherein the temperature sensing voltage is decreased as the temperature of the switch controller is increased.

26. The switch controller of claim 25 , wherein the thermal shutdown reference voltage corresponding to the normal state is higher than the thermal shutdown reference voltage corresponding to the start-up state and lower than the thermal shutdown reference voltage corresponding to the overload state.

27. The switch controller of claim 25 , wherein the thermal shutdown reference voltage corresponding to the protection state is lower than the thermal shutdown reference voltage corresponding to the normal state and the thermal shutdown reference voltage corresponding to the overload state.

Assignments (4)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 04481, FRAME 0541 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0459 →
PATENT SECURITY AGREEMENT Recorded Nov 17, 2017
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 044481/0541 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 15, 2012
From: LEE, MIN-WOO; JANG, KYUNG-OUN; CHO, DAE-WOONG
To: FAIRCHILD KOREA SEMICONDUCTOR LTD.
Reel/Frame 027711/0896 →