Laminated microfluidic structures and method for making
View Patent ↗A method for making a polymeric microfluidic structure in which two or more components (layers) of the microfluidic structure are fixedly bonded or laminated with a weak solvent bonding agent, particularly acetonitrile or a mixture of acetonitrile and alcohol. In an aspect, acetonitrile can be used as a weak solvent bonding agent to enclose a microstructure fabricated in or on a non-elastomeric polymer such as polystyrene, polycarbonate, acrylic or other linear polymer to form a three-dimensional microfluidic network. The method involves the steps of wetting at least one of the opposing surfaces of the polymeric substrate components with the weak solvent bonding agent in a given, lower temperature range, adjacently contacting the opposing surfaces, and thermally activating the bonding agent at a higher temperature than the lower temperature range for a given period of time. The contacted polymeric substrates may also be aligned prior to thermal activation and compressed during thermal activation. A laminated, polymeric microfluidic structure is also disclosed.
1. A method of making a laminated, polymeric microfluidic structure, comprising:
providing a first component having first and second surfaces, wherein at least one of the surfaces includes a microstructure, further wherein the first component is a polymeric material;
providing at least a second, polymeric component having first and second surfaces, wherein one of the first and second surface of the first component is intended to be fixedly attached to a respective second and first opposing surface of the second component;
applying a weak solvent bonding agent with respect to the polymeric components to at least one of the first and the second component at a first temperature, wherein the weak solvent bonding agent is an organic solvent having little or substantially no bonding effect on the polymeric components at the first temperature without a thermal activation step;
adjacently contacting the opposing surfaces of the first polymeric component and the at least the second polymeric component; and
thermally activating the weak solvent by raising the first temperature to a second temperature that is greater than the first temperature to actuate the bonding effect of the weak solvent bonding agent.
2. The method of claim 1 , comprising applying the weak solvent bonding agent at the first temperature being approximately room temperature or lower.
3. The method of claim 1 , wherein applying the weak solvent bonding agent comprises spraying the bonding agent onto one of the first and second surface of at least one of the first and second component.
4. The method of claim 1 , wherein applying the weak solvent bonding agent comprises dipping at least one of the first and second component into a supply of the weak solvent bonding agent.
5. The method of claim 1 , wherein applying the bonding agent comprises adjacently contacting the first and second components and applying the weak solvent bonding agent to at least one common edge of the adjacently contacted components.
6. The method of claim 1 , further comprising aligning the first and second components after adjacently contacting them, after applying the bonding agent, prior to thermally activating the applied weak solvent bonding agent.
7. The method of claim 1 , further comprising aligning the first and second components after adjacently contacting them, before applying the weak solvent bonding agent.
8. The method of claim 1 , further comprising applying pressure to the exposed surfaces of the adjacently connected components during the thermal activation of the bonding agent.
9. The method of claim 1 , wherein the step of applying a weak solvent bonding agent further comprises controlling the presence of the bonding agent in the microstructure.
10. The method of claim 9 , wherein controlling the presence of the bonding agent in the microstructure comprises physically separating at least a portion of the microstructure from the second component.
11. The method of claim 1 , comprising cooling the at least one of the at least two components prior to applying the weak solvent bonding agent.