Solar module structures and assembly methods for three-dimensional thin-film solar cells
Solar module structures 210 and 270 and methods for assembling solar module structures. The solar module structures 210 and 270 comprise three-dimensional thin-film solar cells 110 arranged in solar module structures 210 and 270 . The three-dimensional thin-film solar cell comprises a three-dimensional thin-film solar cell substrate ( 124 and 122 , respectively) with emitter junction regions 1352 and doped base regions 1360 . The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The 3-D TFSC substrate comprises a plurality of single-aperture or dual-aperture unit cells. The solar module structures 270 using three-dimensional thin-film solar cells comprising three-dimensional thin-film solar cell substrates with a plurality of dual-aperture unit cells may be used in solar glass applications. The solar module structures 210 using three-dimensional thin-film solar cells comprising three-dimensional thin-film solar cell substrates with a plurality of single-aperture unit cells may be used in building façade and rooftop installation applications as well as for centralized solar electricity generation.
1. A solar module structure, comprising:
a top encapsulant layer;
a plurality of thin crystalline semiconductor solar cells, each thin crystalline semiconductor solar cell comprising:
a thin crystalline semiconductor solar cell substrate comprising doped emitter junction regions and doped base regions;
emitter metallization regions; and
base metallization regions;
a printed circuit board comprising a top patterned electrical layer on the printed circuit board frontside and attached individually and discretely to each of said plurality of thin crystalline semiconductor solar cells and a continuous rear patterned electrical interconnect layer on the printed circuit board backside and electrically connected to said top patterned electrical layer through vias in said printed circuit board, said top patterned electrical layer electrically contacting both emitter and base metallization regions for each of said solar cells, said continuous rear patterned electrical interconnect layer electrically interconnecting adjacent thin crystalline semiconductor solar cells of said module,
a plurality of shunt diodes positioned on and directly attached to said continuous rear patterned electrical interconnect layer, each shunt diode corresponding to each of said thin crystalline semiconductor solar cells, said shunt diodes embedded within said module structure;
a rear encapsulant layer; and
a protective back sheet.
2. The solar module structure of claim 1 , wherein copper-filled via plugs connect said top patterned electrical layer to said rear patterned electrical interconnect layer.
3. The solar module structure of claim 1 , wherein said top patterned electrical layer and said continuous rear patterned electrical interconnect layer are copper.
4. The solar module structure of claim 1 , wherein said top patterned electrical layer and said continuous rear patterned electrical interconnect layer are aluminum.
5. The solar module structure of claim 1 , wherein each of said thin crystalline semiconductor solar cell further comprises a peripheral cell frame with wrap-through or wrap-around metallization contacting said emitter metallization regions.
6. The solar module structure of claim 1 , wherein said plurality of thin crystalline semiconductor solar cells are connected in series.
7. The solar module structure of claim 1 , wherein said printed circuit board comprises a flexible material.
8. The solar module structure of claim 1 , wherein said printed circuit board comprises carbon.
9. The solar module structure of claim 1 , wherein said printed circuit board is a heat sink minimizing temperature cycling of the thin crystalline semiconductor solar cells.
10. The solar module structure of claim 1 , wherein said thin crystalline semiconductor substrate is a crystalline silicon substrate.