Phosphor suspended in silicone, molded/formed and used in a remote phosphor configuration
View Patent ↗A light emitting package comprising a support hosting at least one light emitting diode. A light transmissive dome comprised of a silicone including a phosphor material positioned to receive light emitted by the diode. A glass cap overlies said dome.
1. A method for manufacturing a light emitting package, the method comprising:
securing at least one light emitting chip to a board;
premixing two or more parts of silicone with phosphor material forming a feedstock;
shaping said feedstock within a glass dome remote from the at least one light emitting chip to form a silicone shell;
post-processing said silicone shell with phosphors suspended therein;
disposing said shell and dome over and remote from said light emitting chip;
securing said shell and dome to said board; and
wherein said glass dome is in thermal communication with said silicone shell and said board.
2. The method of claim 1 further comprising filling an interior volume between the silicone shell and the board with an encapsulant.
3. The method of claim 1 wherein said securing steps comprise application of a thermally conductive adhesive.
4. The method of claim 1 wherein said silicone shell includes a diameter of greater than about 20 mm.
5. The method of claim 1 wherein said phosphor material comprises a mixture of different phosphors emitting to create a white light blend.
6. The method of claim 1 wherein said securing step employs an adhesive having a thermal conductivity of at least 1 w/m/° K for securing said shell and dome to said board.
7. The method of claim 1 wherein said silicone comprises a transparent methyl based silicone having a shore A hardness between about 41 and 46, a refractive index greater than about 1.3 and a tensile strength greater than about 5.5 MPa.
8. The method of claim 1 wherein said silicone and said dome are concentrically shaped.
9. The method of claim 1 wherein said silicone includes a thermally conductive filler.
10. The method of claim 9 wherein said filler is selected from Al 2 O 3 , ITO, AlN and mixtures thereof.
11. The method of claim 9 wherein said filler has an average particle size of about 10 nm.
12. The method of claim 1 comprising at least two light emitting diodes disposed within said dome.
13. The method of claim 1 wherein said post-processing comprises thermal cross-linking.