Grooved circuit board accommodating mixed-size components

1. A method of providing a circuit board prepared for assembly, the method comprising:

a) providing the circuit board, the circuit board comprising:

i) a surface layer having a predetermined region configured to accommodate a first component;

ii) an insulating layer adjacent to the surface layer; and

iii) an elongated groove formed in the surface layer adjacent to the predetermined region, the elongated groove extending a determined depth into the insulating layer and configured to accommodate a corresponding elongated footing of a second component, a body portion of the second component extending overtop of the first component, said elongated footing defining a substantial portion of a perimeter of the second component; and

b) depositing conductive paste onto the circuit board, the conductive paste deposited on the predetermined region in a pattern corresponding to a footprint of the first component, the conductive paste further deposited in the elongated groove for reliably accommodating the elongated footing of the second component;

wherein the determined depth is determined by:

i) determining a maximum stencil thickness based on a minimum aperture size required in a stencil to be used for depositing conductive paste onto the surface layer for accommodating the first component;

ii) determining a minimum conductive paste depth required for the second component;

iii) providing the stencil having a selected stencil thickness less than or equal to the maximum stencil thickness;

iv) comparing the minimum conductive paste depth for the second component with the selected stencil thickness, the minimum conductive paste depth exceeding the selected stencil thickness; and

v) determining the determined depth to be at least equal to a difference between the minimum conductive paste depth and the selected stencil thickness.

2. The method according to claim 1 , wherein the conductive paste is deposited concurrently onto the predetermined region and into the elongated groove via the stencil.

3. The method according to claim 2 , wherein the selected stencil thickness is selected at least in part to facilitate said deposition of the conductive paste in the pattern corresponding to the footprint of the first component.

4. The method according to claim 3 , wherein the elongated footing has a predetermined coplanarity variation, conductive paste is applied to the groove to a depth substantially equal to a depth of the groove plus the selected stencil thickness, and the determined depth is at least equal to the predetermined coplanarity variation.

5. The method according to claim 2 , wherein the stencil comprises one or more apertures for deposition of the conductive paste into the elongated groove, the one or more apertures defining a perimeter around the elongated groove, the stencil configured to substantially sealingly engage with the circuit board during deposition of the conductive paste into the elongated groove.

6. The method according to claim 1 , further comprising populating the circuit board with at least the first component followed by at least the second component.

7. The method of claim 1 , wherein the first component is a surface mount component and the second component is a radio frequency shield.

8. A method of preparing a circuit board, the circuit board comprising: a surface layer having a predetermined region configured to accommodate a first component; and an insulating layer adjacent to the surface layer; the method comprising: forming an elongated groove in the surface layer adjacent to the predetermined region, the elongated groove extending a determined depth into the insulating layer and configured to accommodate a corresponding elongated footing of a second component, a body portion of the second component extending overtop of the first component, said elongated footing defining a substantial portion of a perimeter of the second component; wherein the determined depth is determined by:

i) determining a maximum stencil thickness based on a minimum aperture size required in a stencil to be used for depositing conductive paste onto the surface layer for accommodating the first component;

ii) determining a minimum conductive paste depth required for the second component;

iii) providing the stencil having a selected stencil thickness less than or equal to the maximum stencil thickness;

iv) comparing the minimum conductive paste depth for the second component with the selected stencil thickness, the minimum conductive paste depth exceeding the selected stencil thickness; and

v) determining the determined depth to be at least equal to a difference between the minimum conductive paste depth and the selected stencil thickness.

9. The method according to claim 8 , wherein the elongated footing has a predetermined coplanarity variation, and wherein conductive paste is applied in the groove to a paste depth at least equal to the determined depth, and wherein the determined depth is at least equal to the predetermined coplanarity variation.

10. The method according to claim 9 , wherein the conductive paste is deposited via the stencil, and wherein the paste depth is substantially equal to a depth of the groove plus the selected stencil thickness.

11. The method according to claim 10 , wherein the conductive paste is deposited via the stencil to both the elongated groove and to the predetermined region, the conductive paste deposited to the predetermined region in a pattern corresponding to a footprint of the first component.

12. The method according to claim 11 , wherein the selected stencil thickness is selected at least in part to facilitate said deposition of the conductive paste in the pattern corresponding to the footprint of the first component.

13. The method according to claim 8 , wherein the elongated groove extends to an internal conductive layer of the circuit board.

14. The method according to claim 8 , wherein the determined depth is configured at least in part to compensates for paste displacement due to the elongated footing, paste volume reduction due to further processing, or both.

15. The method according to claim 8 , wherein the stencil comprises one or more apertures for deposition of the conductive paste into the elongated groove, the one or more apertures defining a perimeter around the elongated groove, the stencil configured to substantially sealingly engage with the circuit board during deposition of the conductive paste into the elongated groove.

16. The method according to claim 8 , further comprising populating the circuit board with at least the first component followed by at least the second component.

17. The method of claim 8 , wherein the first component is a surface mount component and the second component is a radio frequency shield.