IP Library Patent Application 13188187
Patent Application
App. No. 13/188,187

LED-BASED LIGHT EMITTING DEVICES

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Quick Facts
Patent No.
US None
App. No.
13/188,187
Abstract

An LED-based light emitting device comprises: a substrate; at least one LED die mounted to the substrate; at least one bond wire that electrically connects the LED die; and a light transmissive material (silicone) encapsulating the at least one LED die and at least one bond wire. The at least one bond wire has a hook-shaped portion that loops back on itself.

Claims (16)

1 . A light emitting device comprising:

a substrate;

at least one LED die mounted to the substrate;

at least one bond wire that electrically connects the LED die; and

a light transmissive material encapsulating the at least one LED die and at least one bond wire; wherein

the at least one bond wire has a hook-shaped portion that loops back on itself.

2 . The device of claim 1 , wherein the hook-shaped portion extends above the LED die by a distance of at least 0.2 mm.

3 . The device of claim 1 , wherein the hook-shaped portion is substantially semicircular in form.

4 . The device of claim 2 , wherein the hook-shaped portion has a radius of at least 0.1 mm.

5 . The device of claim 1 , wherein the at least one bond wire is “candy cane” in shape.

6 . The device of claim 1 , wherein the substrate comprises a package having a cavity in which the at least one LED die is mounted.

7 . The device of claim 1 , wherein the substrate comprises a metal core printed circuit board.

8 . A light emitting device comprising: at least one LED die that is electrically connected by a bond wire having a hook-shaped portion that loops back on itself.

9 . The device of claim 8 , wherein the wherein the hook-shaped portion extends above the LED die by a distance of at least 0.2 mm.

10 . The device of claim 8 , wherein the hook-shaped portion is substantially semicircular in form.

11 . The device of claim 10 , wherein the hook-shaped portion has a radius of at least 0.1 mm.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Apr 14, 2022
From: EAST WEST BANK
To: INTEMATIX HONG KONG CO. LIMITED; INTEMATIX CORPORATION
Reel/Frame 059910/0304 →
SECURITY INTEREST Recorded Oct 27, 2015
From: INTEMATIX HONG KONG CO. LIMITED; INTEMATIX CORPORATION
To: EAST WEST BANK
Reel/Frame 036967/0623 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2011
From: LI, YI-QIN; EDWARDS, CHARLES OWEN; HUANG, CHIH-WEI; LIU, AH (AN HSUAN)
To: INTEMATIX CORPORATION
Reel/Frame 026905/0855 →