IP Library Granted Patent US 8,847,060
Granted Patent B2
US 8,847,060 · App. 13/188,303 · Granted Sep 30, 2014

Solar module structures and assembly methods for pyramidal three-dimensional thin-film solar cells

Inventor: Mehrdad M. Moslehi (Los Altos, CA)
Assignee: Solexel, Inc.
H01L31/042H01L31/0504H01L27/1423H01L31/048H01L31/05H01L31/0527H01L31/18Y02B10/12Y02E10/52
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Quick Facts
Patent No.
US 8,847,060
App. No.
13/188,303
Granted
Sep 30, 2014
Kind
B2
Abstract

Solar module structures and methods for assembling solar module structures. The solar module structures comprise pyramidal three-dimensional thin-film solar cells arranged in solar module structures. The pyramidal three-dimensional thin-film solar cell comprises a pyramidal three-dimensional thin-film solar cell substrate with emitter junction regions and doped base regions. The three-dimensional thin-film solar cell further includes emitter metallization regions and base metallization regions. The three-dimensional thin-film solar cell substrate comprises a plurality of pyramid-shaped unit cells. The solar module structures may be used in solar glass applications, building façade applications, rooftop installation applications as well as for centralized solar electricity generation.

Claims (18)

1. A solar module structure, comprising:

a top encapsulant layer;

a plurality of thin crystalline semiconductor solar cells, each thin crystalline semiconductor solar cell comprising:

a thin crystalline semiconductor solar cell substrate comprising emitter regions and base regions;

emitter metallization regions; and

base metallization regions

a printed circuit board comprising a top patterned electrical layer on the printed circuit board frontside and attached individually and discretely to each of said plurality of thin crystalline semiconductor solar cells and a continuous rear patterned electrical interconnect layer on the printed circuit board backside and electrically connected to said top patterned electrical layer through vias in said printed circuit board, said top patterned electrical layer electrically contacting both emitter and base metallization regions for each of said solar cells, said continuous rear patterned electrical interconnect layer electrically interconnecting said plurality of thin crystalline semiconductor solar cells of said module,

a plurality of shunt diodes positioned on and directly attached to said continuous rear patterned electrical interconnect layer, each shunt diode corresponding to each of said thin crystalline semiconductor solar cells, said shunt diodes embedded within said module structure;

a rear encapsulant layer.

2. The solar module structure of claim 1 , wherein copper-filled via plugs connect said top patterned electrical layer to said rear patterned electrical interconnect layer.

3. The solar module structure of claim 1 , wherein said top patterned electrical layer and said continuous rear patterned electrical interconnect layer are copper.

4. The solar module structure of claim 1 , wherein said top patterned electrical layer and said continuous rear patterned electrical interconnect layer are aluminum.

5. The solar module structure of claim 1 , wherein each of said thin crystalline semiconductor solar cell further comprises a peripheral cell frame with wrap-through or wrap-around metallization contacting said emitter metallization regions.

6. The solar module structure of claim 1 , wherein said plurality of thin crystalline semiconductor solar cells are connected in series.

7. The solar module structure of claim 1 , wherein said printed circuit board comprises a flexible material.

8. The solar module structure of claim 1 , wherein said printed circuit board comprises carbon.

9. The solar module structure of claim 1 , wherein said printed circuit board is a heat sink minimizing temperature cycling of the thin crystalline semiconductor solar cells.

10. The solar module structure of claim 1 , wherein said thin crystalline semiconductor substrate is a crystalline silicon substrate.

Assignments (6)
ASSIGNMENT OF LOAN DOCUMENTS Recorded Sep 29, 2017
From: OPUS BANK
To: OB REALTY, LLC
Reel/Frame 044062/0383 →
CHANGE OF NAME Recorded Jul 28, 2017
From: SOLEXEL, INC.
To: BEAMREACH SOLAR, INC.
Reel/Frame 043367/0649 →
RECORDATION OF FORECLOSURE OF PATENT PROPERTIES Recorded Jul 27, 2017
From: OB REALTY, LLC
To: OB REALTY, LLC
Reel/Frame 043350/0822 →
CHANGE OF NAME Recorded Jul 26, 2017
From: SOLEXEL, INC.
To: BEAMREACH SOLAR, INC.
Reel/Frame 043342/0439 →
SECURITY INTEREST Recorded Jan 7, 2015
From: SOLEXEL, INC.
To: OPUS BANK
Reel/Frame 034731/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 8, 2012
From: MOSLEHI, MEHRDAD M.
To: SOLEXEL, INC.
Reel/Frame 028173/0675 →
Continuity (4)
Continuation 11868494 · Oct 6, 2007
Provisional Application 60828678 · Oct 9, 2006
Provisional Application 60886303 · Jan 24, 2007
Related Publication 20120012160A1 · Jan 19, 2012