Modified 0402 footprint for a printed circuit board (‘PCB’)
View Patent ↗A modified 0402 footprint for a PCB, including: at least two padstacks each having a minimum area consistent with the 0402 standard; and each padstack modified on at least two corners such that the padstack's footprint can be placed beneath a ball grid array (‘BGA’), the BGA having approximately a 1 millimeter pitch, and such that the padstack may be placed at least at a minimum distance away from a closest via in the PCB, wherein each padstack has a trace to a via not directly under a padstack in the PCB and each padstack has no via within the padstack.
1. A modified 0402 footprint for a printed circuit board (‘PCB’) comprising:
at least two padstacks each having a minimum area consistent with the 0402 standard; and
each padstack, having two modified corners and two unmodified corners, each modified corner modified such that the padstack's footprint can be placed beneath a ball grid array (‘BGA’), the BGA having approximately a 1 millimeter pitch, and such that the padstack may be placed at least at a minimum distance away from a closest via in the PCB, wherein each padstack has a trace to a via not directly under a padstack in the PCB and each padstack has no via within the padstack;
wherein each padstack is placed in an offset position underneath a ball that resides on the opposite side of the PCB as the padstacks such that the ball is closer to the unmodified corners of the padstack than the modified corners of the padstack.
2. The modified 0402 footprint for a PCB of claim 1 wherein each modified corner of each padstack is at least 0.45 millimeters away all vias in the PCB.
3. The modified 0402 footprint for a PCB of claim 1 wherein each modified corner has at least 0.1 millimeters of each side that formed the original corner removed.
4. The modified 0402 footprint for a PCB of claim 1 wherein each padstack is separated by at least 0.3 millimeters.
5. The modified 0402 footprint for a PCB of claim 1 wherein approximately a 1 millimeter pitch further comprises a pitch within the range 0.9-1.1 millimeters.
6. The modified 0402 footprint for a PCB of claim 1 wherein approximately a 1 millimeter pitch further comprises a 1 millimeter pitch.
7. A printed circuit board (‘PCB’) comprising:
a ball grid array (‘BGA’) having a particular pitch;
a plurality of vias from the balls of the ball grid array through the PCB;
a plurality of capacitors, each capacitor offset from the vias on the bottom of the PCB, wherein each capacitor is connected to a via by a trace and each capacitor is shaped such that the length of the trace is at least a threshold length required by the pitch and width of the vias; and
a plurality of padstacks, each padstack coupled to a capacitor, each padstack having two modified corners and two unmodified corners, each modified corner modified such that the padstack can be placed beneath the BGA such that the padstack may be placed at least at a minimum distance away from a closest via in the PCB, wherein each padstack has a trace to a via not directly under a padstack in the PCB and each padstack has no via within the padstack; wherein each padstack is placed in an offset position underneath a ball that resides on the opposite side of the PCB as the padstacks such that the ball is closer to the unmodified corners of the padstack than the modified corners of the padstack.
8. The PCB of claim 7 wherein the particular pitch is within a range of 0.9-1.1 millimeters.
9. The PCB of claim 7 wherein the particular pitch is 1 millimeter.
10. The PCB of claim 7 wherein the threshold length is within a range of 0.4-0.5 millimeters.
11. The PCB of claim 7 wherein the threshold length is 0.45 millimeters.
12. The PCB of claim 7 wherein the capacitors are decoupling capacitors.