IP Library Granted Patent US 8,400,835
Granted Patent B2
US 8,400,835 · App. 13/190,130 · Granted Mar 19, 2013

Non-volatile semiconductor memory

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Quick Facts
Patent No.
US 8,400,835
App. No.
13/190,130
Granted
Mar 19, 2013
Kind
B2
Abstract

When a plurality of non-volatile memory cells in a memory cell array are simultaneously written, bit lines of the plurality of non-volatile memory cells are connected to M data lines, where M is an integer of two or more, based on a column address signal. N switches, where N is an integer of one or more, and a switch control circuit for controlling the N switches, are provided for each data line. The M switch control circuits control the M×N switches to change the levels or apply periods of drain voltages applied to the bit lines of the plurality of memory cells on a memory cell-by-memory cell basis.

Claims (31)

1. A non-volatile semiconductor memory in which a plurality of non-volatile memory cells can be simultaneously written using a plurality of bit lines, the device comprising:

M data lines connected to the plurality of bit lines based on a column address signal, where M is an integer of two or more and is smaller than the number of the bit lines;

a drain voltage generation circuit configured to generate a voltage which is a source of a drain voltage of each of the plurality of non-volatile memory cells;

a drain voltage supply line connected to an output of the drain voltage generation circuit; and

M switch circuits and M switch control circuits provided between the M data lines and the drain voltage supply line,

wherein

each of the M switch circuits includes N switches, where N is an integer of one or more,

each of the M×N switches includes a first and a second terminal, and the first terminals of the N switches of each of the M switch circuits are connected at a common point to a corresponding one of the M data lines, and the second terminals of the N switches of each of the M switch circuits are connected at a common point to the drain voltage supply line, and

the drain voltage supply line is connected to the M data lines via the M×N switches, and the M×N switches are controlled by the M switch control circuits.

2. The non-volatile semiconductor memory of claim 1 , wherein

the N switches of each of the M switch circuits each include a transistor of a first conductivity type, the N transistors being connected together in parallel, and

when the drain voltage is applied to one of the M data lines, at least one of the N transistors of a corresponding one of the M switch circuits is turned on by a corresponding one of the M switch control circuits.

3. The non-volatile semiconductor memory of claim 1 , wherein

the N switches of each of the M switch circuits include a P-type transistor and an N-type transistor connected together in parallel, and

when the drain voltage is applied to one of the M data lines, one of the P-type and N-type transistors of a corresponding one of the M switch circuits is turned on by a corresponding one of the M switch control circuits.

4. The non-volatile semiconductor memory of claim 1 , wherein

the M switch control circuits control combination of on and off states of the N switches connected to a corresponding one of the M data lines on a data line-by-data line basis.

5. The non-volatile semiconductor memory of claim 1 , wherein

the M switch control circuits control on-state periods of the N switches connected to a corresponding one of the M data lines on a data line-by-data line basis.

6. The non-volatile semiconductor memory of claim 1 , further comprising:

a read circuit configured to receive the M data lines; and

a state storage circuit configured to receive M read signals output from the read circuit,

wherein

the M switch circuits are controlled based on M state output signals output from the state storage circuit.

7. The non-volatile semiconductor memory of claim 6 , wherein

the plurality of non-volatile memory cells can each store a plurality of bits of data, where the data can be written by reversing a relationship between a source voltage and a drain voltage thereof,

when a first bit is written by application of a source-drain voltage in a first direction, a memory state of a second bit to be written is read out by application of a source-drain voltage in a second direction opposite to the first direction, and the read memory state is stored in the state storage circuit, and

a manner in which the M switch control circuits are controlled is changed based on the memory state stored in the state storage circuit.

8. The non-volatile semiconductor memory of claim 6 , wherein

when the plurality of non-volatile memory cells are written, a threshold level state of a memory cell to be written is read out, and the read threshold level state is stored in the state storage circuit, and

a manner in which the M switch control circuits are controlled is changed based on the threshold level state stored in the state storage circuit.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2024
From: NUVOTON TECHNOLOGY CORPORATION JAPAN
To: ADVANCED MEMORY TECHNOLOGIES LLC
Reel/Frame 067184/0869 →
CHANGE OF NAME Recorded Mar 20, 2024
From: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
To: NUVOTON TECHNOLOGY CORPORATION JAPAN
Reel/Frame 066849/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2020
From: PANASONIC CORPORATION
To: PANASONIC SEMICONDUCTOR SOLUTIONS CO., LTD.
Reel/Frame 053570/0429 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: HAMAMOTO, YUKIMASA; TOKI, MASAHIRO
To: PANASONIC CORPORATION
Reel/Frame 026869/0683 →