Substrate for mounting light-emitting element, production process thereof and light-emitting device
View Patent ↗To provide a substrate for mounting a light-emitting device, which is provided with a silver reflection layer having a high reflectance and being less susceptible to deterioration of the reflectance due to corrosion and which has an improved light extraction efficiency. A substrate for mounting a light-emitting element 1 , which comprises a substrate main body 2 , a silver reflection layer 6 composed mainly of silver or a silver alloy, formed on the substrate main body 2 , and a protective layer formed so as to cover the entire surface of the silver reflection layer 6 , wherein the protective layer 7 contains an alumina filler and further contains a glass constituting the protective layer 7 , having silver ions diffused therein. The concentration of silver ions contained in the glass of the protective layer 7 is at least 0.5 mass % and at most 5.0 mass %.
1. A substrate for mounting a light-emitting element, which comprises:
a substrate main body having a mounting surface on which the light-emitting element is to be mounted,
a reflection layer composed mainly of silver or a silver alloy, formed on the mounting surface of the substrate main body, and
a protective layer, formed so as to cover an entire surface of the reflection layer,
wherein the protective layer comprises: an alumina filler and a glass which comprises silver ions diffused therein, and
wherein the glass is obtained by firing a glass powder comprising, as represented by mol % based on oxides, from 40 to 70% of SiO 2 , from 1 to 20% of Al 2 O 3 , from 5 to 25% of B 2 O 3 , from 7 to 40% of CaO, and from 0 to 8% of at least one member selected from the group consisting of Li 2 O, Na 2 O and K 2 O.
2. The substrate for mounting a light-emitting element according to claim 1 , wherein a concentration of silver ions contained in the glass, measured as a mass % of Ag 2 O in the glass, is at least 0.5 mass % and at most 5.0 mass %.
3. A process for producing the substrate for mounting a light-emitting element as defined in claim 1 , which comprises:
a step of preparing a first green sheet for forming the substrate main body,
a step of forming a paste layer for the reflection layer for forming the reflection layer, on the surface to be the mounting surface for the first green sheet,
a step of forming a layer of a precursor for forming the protective layer so as to cover the entire surface of the paste layer for the reflection layer, and
a step of firing a non-sintered substrate for mounting a light-emitting element obtained in the above steps.
4. The process for producing a substrate for mounting a light-emitting element according to claim 3 , wherein the step of forming a layer of a precursor has a step of printing a glass ceramics paste containing the glass powder and the alumina filler.
5. A light-emitting device comprising:
the substrate for mounting a light-emitting element as defined in claim 1 , and
the light-emitting element to be mounted on a mounting portion of the substrate for mounting a light-emitting element.
6. The light-emitting device according to claim 5 , wherein a part or all of the surface of the protective layer is sealed with a silicone resin containing a platinum catalyst.
7. The substrate for mounting a light-emitting element according to claim 1 , wherein the glass powder comprises, as represented by mol % based on oxides, from 4 to 15% of Al 2 O 3 .
8. The substrate for mounting a light-emitting element according to claim 1 , wherein the glass powder comprises, as represented by mol % based on oxides, from 7 to 35% of CaO.
9. The substrate for mounting a light-emitting element according to claim 1 , wherein a concentration of silver ions in the glass, measured as a mass % of Ag 2 O in the glass, is at least 1.0 mass % and at most 5.0 mass %.
10. The substrate for mounting a light-emitting element according to claim 1 , wherein a concentration of silver ions in the glass, measured as a mass % of Ag 2 O in the glass, is at least 2.0 mass % and at most 5.0 mass %.