IP Library Granted Patent US 8,675,363
Granted Patent B2
US 8,675,363 · App. 13/191,071 · Granted Mar 18, 2014

Thermal conductors in electronic devices

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Quick Facts
Patent No.
US 8,675,363
App. No.
13/191,071
Granted
Mar 18, 2014
Kind
B2
Abstract

In one implementation, an electronic device includes a first body portion, a second body portion movably coupled to the first body portion, a heat source, and a thermal conductor in thermal communication with the heat source. The heat source is disposed within one of the first body portion or the second body portion. The thermal conductor has a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion. The first end portion of the thermal conductor is disposed within the first body portion. The second end portion of the thermal conductor is disposed within the second body portion.

Claims (33)

1. An electronic device, comprising:

a first body portion;

a second body portion slidably coupled to the first body portion;

a heat source disposed within the first body portion; and

a thermal conductor in thermal communication with the heat source and having a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion,

the first end portion disposed within the first body portion,

the second end portion disposed within the second body portion,

the flexible portion extending from the first body portion to conduct heat into the second body portion.

2. The electronic device of claim 1 , wherein the heat source includes at least one of a processor package or a radio frequency power amplifier package.

3. The electronic device of claim 1 , wherein the thermal conductor is coupled to a housing of the heat source.

4. The electronic device of claim 1 , wherein the thermal conductor includes a plurality of layers.

5. The electronic device of claim 1 , wherein the thermal conductor includes a graphite film.

6. The electronic device of claim 1 , wherein the thermal conductor defines a plurality of thermal paths.

7. The electronic device of claim 1 , wherein the flexible portion defines a first bend and a second bend, the electronic device further comprising:

a first guide member disposed to prevent straightening of the first bend; and

a second guide member disposed to prevent straightening of the second bend.

8. An electronic device, comprising:

a first body portion;

a second body portion;

a heat source disposed within one of the first body portion or the second body portion; and

a thermal conductor in thermal communication with the heat source and comprising a first layer, a second layer, and a third layer that is between the first and second layers, the thermal conductor further having a first end portion, a second end portion, and a flexible portion between the first end portion and the second end portion, wherein

the first end portion is disposed within the first body portion,

the second end portion is disposed within the second body portion,

a portion of the first layer is absent to expose a portion of the third layer in the first end portion or the second end portion proximal to the heat source.

9. The electronic device of claim 8 , wherein the heat source includes at least one of a processor package or a radio frequency power amplifier package.

10. The electronic device of claim 8 , wherein the thermal conductor is coupled to a housing of the heat source.

11. The electronic device of claim 8 , wherein the first layer and the second layer are different from the third layer.

12. The electronic device of claim 8 , wherein the third layer comprises a graphite film.

13. The electronic device of claim 12 , wherein the first and second layers comprise plastic.

14. The electronic device of claim 8 , wherein the second body portion is rotatably coupled to the first body portion about the flexible portion of the thermal conductor.

15. The electronic device of claim 8 , wherein the second body portion is slidably coupled to the first body portion.

16. The electronic device of claim 1 , wherein the flexible portion extends between the first end portion and the second end portion and includes scores that improve flexing characteristics of the flexible portion.

17. The electronic device of claim 1 , wherein the thermal conductor comprises a first layer, a second layer, and a third layer that is between the first and second layers, and a portion of the first layer is absent to expose a portion of the third layer in the first end portion or the second end portion proximal to the heat source.

Assignments (8)
CORRECTIVE ASSIGNMENT TO CORRECT THE INCORRECT NUMBER WAS 13/191,070. THE NO. SHOULD BE 13/191,071 PREVIOUSLY RECORDED AT REEL: 27230 FRAME: 50. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 5, 2024
From: CROOIJMANS, WILHELMUS; EEN, JOSHUA
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 068132/0451 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 28, 2014
From: HEWLETT-PACKARD COMPANY; HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.; PALM, INC.
To: QUALCOMM INCORPORATED
Reel/Frame 032177/0210 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 031837/0544 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0659 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2013
From: PALM, INC.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 031837/0239 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 3, 2013
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: PALM, INC.
Reel/Frame 030341/0459 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 30, 2011
From: CROOIJMANS, WILHELMUS; EEN, JOSHUA
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 027302/0004 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2011
From: CROOIJMANS, WILHELMUS; EEN, JOSHUA
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 027230/0050 →