IP Library Granted Patent US 8,866,064
Granted Patent B2
US 8,866,064 · App. 13/191,260 · Granted Oct 21, 2014

Multi-directional proximity sensor

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Quick Facts
Patent No.
US 8,866,064
App. No.
13/191,260
Granted
Oct 21, 2014
Kind
B2
Abstract

A proximity sensor with multi-directional movement detection is provided. The proximity sensor may include an ASIC chip; at least three light sources configured to emit light in a particular sequence; and a photo detector configured to receive light and generate an output signal. The multi-directional proximity sensor may have a first proximity sensor with at least one side surface and a second proximity sensor connected to the first proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the first proximity sensor. The multi-directional movement detection proximity sensor may include a PCB, in which more than one proximity sensor may be disposed on the PCB and operatively integrated to detect multi-directional movement.

Claims (34)

1. A proximity sensor with movement detection comprising:

a plurality of light sources configured to emit light;

a photo detector configured to receive light and generate an output signal;

a substrate comprising a top surface and an opposing surface, wherein the photo detector, the plurality of light sources are mounted on the top surface of the substrate;

at least one side surface of the substrate extending between the top surface and the opposing surface; and

a plurality of side contact pads provided integrally within the substrate on the at least one side surface of the substrate, wherein the plurality of side contact pads extend planarly perpendicular to the top surface and the opposing surface, and wherein the plurality of side contact pads are being exposed so as to receive an electrical contact on the at least one side surface of the substrate.

2. The proximity sensor of claim 1 , wherein the plurality of side contact pads of the at least one side surface of the substrate is configured to receive at least one other proximity sensor, wherein the at least one other proximity sensor is configured to detect object movement over a plane substantially parallel to the at least one side surface of the substrate perpendicularly relative to the top surface.

3. The proximity sensor of claim 2 , wherein the at least one other proximity sensor is coupled to the proximity sensor via the plurality of side contact pads of the at least one side surface of the substrate.

4. The proximity sensor of claim 2 , wherein the proximity sensor is configured to provide electrical power to the at least one other proximity sensor through the plurality of side contact pads.

5. The proximity sensor of claim 2 , wherein the proximity sensor and the at least one other proximity sensor are operatively configured to communicate detection signals with each other through the plurality of side contact pads of the at least one side surface of the substrate.

6. A proximity sensor for multi-directional movement detection comprising:

a first proximity sensor comprising a substrate having a top surface and an opposing surface;

at least one side surface of the substrate extends planarly between the top surface and the opposing surface;

a plurality of side contact pads provided integrally within the substrate on the at least one side surface of the substrate and being thereon; and

a second proximity sensor connected to the at least one side surface of the substrate, the second proximity sensor configured to detect object movement over a plane substantially parallel to the at least one side surface of the substrate of the first proximity sensor,

wherein the first proximity sensor further comprises a first light source, a second light source and a photo detector arranged between the first and second light sources, and wherein the first light source, the photo detector, and the second light source are arranged in parallel to the at least one side surface.

7. The proximity sensor of claim 6 , wherein the first proximity sensor is configured to provide electrical power to the second proximity sensor by means of the plurality of side contact pads of the substrate.

8. The proximity sensor of claim 6 , wherein both the first proximity sensor and the second proximity sensor are operatively configured to communicate detection signals with one another through the plurality of side contact pads of the substrate.

9. A multi-directional movement detection proximity sensor comprising:

a PCB having a top surface and an opposing surface;

at least one side surface of the PCB extending between the top surface and the opposing surface;

a plurality of side contact pads provided integrally within the substrate, and being exposed planarly on the at least one side surface of the substrate;

a first proximity sensor disposed on the top surface of the PCB; and

a second proximity sensor operatively coupled to the first proximity sensor, wherein the second proximity sensor is connected to the plurality of side contact pads of the at least one side surface of the PCB and wherein the first and second proximity sensors are operatively integrated to detect multi-directional movement,

wherein the first proximity sensor comprises a first light source, a second light source, a third light source and a photo detector disposed on the top surface of the PCB, and wherein the third light source is arranged such that the first light source, the second light source and the photo detector are the being interposed between the at least one side surface of the PCB and the third light source.

10. The proximity sensor of claim 9 , wherein the second proximity sensor is operatively coupled to the first proximity sensor via the plurality of side contact pads.

11. The proximity sensor of claim 9 , wherein the first proximity sensor and the second proximity sensor are operatively configured to communicate detection signals with one another via the PCB.

12. The proximity sensor of claim 1 , wherein the substrate further comprises an additional side surface of the substrate having an additional plurality of side contacts extending orthogonally relative to the at least one side surface between the top surface and the opposing surface of the substrate.

13. The proximity sensor of claim 6 , wherein the first proximity sensor comprises an additional side surface of the substrate extending orthogonally relative to the at least one side surface between the top surface and the opposing surface of the substrate, and wherein the proximity sensor further comprising a third proximity sensor disposed on the additional side surface of the substrate.

14. The proximity sensor of claim 9 , wherein the PCB further comprising an additional side surface of the PCB extending orthogonally relative to the at least one side surface between the top surface and the opposing surface of the PCB, and wherein the proximity sensor further comprising a third proximity sensor disposed on the additional side surface of the PCB.

15. The proximity sensor of claim 1 , wherein the plurality of light sources comprise a first light source and a second light source sandwiching the photo detector, wherein the first light source, the photo detector, and the second light source are arranged in parallel to the at least one side surface.

16. The proximity sensor of claim 15 , wherein the plurality of light sources further comprising a third light source, and wherein the third light source is arranged such that the first light source, the second light source and the photo detector are being interposed between the at least one side surface of the substrate and the third light source.

17. The proximity sensor of claim 6 , wherein the first proximity sensor further comprises a third light source, and wherein the third light source is arranged such that the first light source, the second light source and the photo detector are being interposed between the at least one side surface of the substrate and the third light source.

18. The proximity sensor of claim 9 , wherein the photo detector is arranged between the first and second light sources, and wherein the first light source, the photo detector, and the second light source are arranged in parallel to the at least one side surface of the PCB.

Assignments (9)
CORRECTIVE ASSIGNMENT TO CORRECT THE ERROR IN RECORDING THE MERGER IN THE INCORRECT US PATENT NO. 8,876,094 PREVIOUSLY RECORDED ON REEL 047351 FRAME 0384. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 8, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 049248/0558 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE OF THE MERGER PREVIOUSLY RECORDED AT REEL: 047230 FRAME: 0910. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047351/0384 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047230/0910 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
MERGER Recorded May 7, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0496 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2011
From: YAO, YUFENG; WONG, CHEE HENG; ONG, SZE PING
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 026652/0523 →