Semiconductor device having a pad

1. A semiconductor device, comprising:

a first insulating film formed on a substrate;

a pad embedded in the first insulating film; and

a second insulating film formed on the first insulating film, the second insulating film having an opening exposing at least part of the pad, wherein

the pad includes a plurality of pad interconnects,

two interconnect links are provided to electrically connect adjacent interconnects among the plurality of pad interconnects, the adjacent interconnects being arranged in a direction parallel to an upper surface of the substrate,

each of top surfaces of the adjacent interconnects and each of top surfaces of the two interconnect links are exposed from the first insulating film,

a width of each of the plurality of pad interconnects is smaller than a height of the plurality of pad interconnects and larger than a width of each of the two interconnect links, and

a spacing between the two interconnect links is two times or more as large as the width of the plurality of pad interconnects.

2. The semiconductor device of claim 1 , wherein the height of the plurality of pad interconnects is 1.5 times to 5 times as large as the width of the plurality of pad interconnects.

3. The semiconductor device of claim 1 , wherein the width of each of the two interconnect links is three quarters or less of the width of the plurality of pad interconnects.

4. The semiconductor device of claim 1 , wherein a spacing between the plurality of pad interconnects is smaller than the width of the plurality of pad interconnects.

5. The semiconductor device of claim 4 , wherein the spacing between the plurality of pad interconnects is three quarters or less of the width of the plurality of pad interconnects.

6. The semiconductor device of claim 1 , wherein a top surface of a portion of the first insulating film located in the opening is at a level lower than the top surfaces of the adjacent interconnects.

7. The semiconductor device of claim 6 , wherein the top surface of a portion of the first insulating film located in the opening is at a level lower than the top surface of a portion of the first insulating film located outside the opening.

8. The semiconductor device of claim 1 , wherein at least part of sidewalls of the opening stands on a center portion of one or more interconnects, among the plurality of pad interconnects, in the width direction.

9. The semiconductor device of claim 1 , wherein a conductive layer is formed in the opening so as to be electrically connected to the part of the pad.

10. The semiconductor device of claim 9 , wherein the conductive layer is also formed on a portion of the second insulating film surrounding the opening.

11. The semiconductor device of claim 1 , further comprising:

a circuit interconnect embedded in the first insulating film, and

a width of the circuit interconnect is smaller than a height of the circuit interconnect.

12. The semiconductor device of claim 11 , wherein the pad and the circuit interconnect are electrically connected to each other via another interconnect formed below the first insulating film.

13. The semiconductor device of claim 11 , wherein the pad and the circuit interconnect are electrically connected to each other by extending at least some of the plurality of pad interconnects to be connected to the circuit interconnect.

14. The semiconductor device of claim 1 , wherein the plurality of pad interconnects each have a stripe shape.

15. The semiconductor device of claim 1 , wherein the plurality of pad interconnects each have a loop shape and are arranged concentrically.

16. The semiconductor device of claim 15 , wherein another interconnect is drawn from an outermost interconnect among the plurality of pad interconnects.

17. The semiconductor device of claim 15 , wherein the loop shape is an octagonal or circular loop shape.

18. The semiconductor device of claim 1 , wherein the plurality of pad interconnects each have a corner at a position closer to the center of the opening and run from the corner toward the outside of the opening in two directions.

19. The semiconductor device of claim 1 , wherein each of bottom surfaces of the adjacent interconnects and each of bottom surfaces of the two interconnect links are at a same level.

20. The semiconductor device of claim 1 , wherein each of top surfaces of the adjacent interconnects are at a same level.

21. A semiconductor device, comprising:

a first insulating film formed on a substrate;

a pad embedded in the first insulating film; and

a second insulating film formed on the first insulating film, the second insulating film having an opening exposing at least part of the pad, wherein

the pad includes a plurality of pad interconnects,

two interconnect links are provided to electrically connect adjacent interconnects among the plurality of pad interconnects the adjacent interconnects being arranged in a direction parallel to an upper surface of the substrate,

each of top surfaces of the adjacent interconnects and each of top surfaces of the two interconnect links are exposed from the first insulating film,

a width of each of the plurality of pad interconnects is smaller than a height of the plurality of pad interconnects and larger than a width of each of the two interconnect links, and

when one of the two interconnect links is provided between the adjacent interconnects at a position of one side of each of the interconnects, another of the two interconnect links is not provided at a position of the other side of the interconnect opposite to the position of the one interconnect link.