IP Library Granted Patent US 8,647,796
Granted Patent B2
US 8,647,796 · App. 13/192,113 · Granted Feb 11, 2014

Photoactive compound gradient photoresist

Inventors: Chen-Hua Yu (Hsin-Chu, TW); Chung-Shi Liu (Hsin-Chu, TW); Hung-Jui Kuo (Hsin-Chu, TW)
Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
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Quick Facts
Patent No.
US 8,647,796
App. No.
13/192,113
Granted
Feb 11, 2014
Kind
B2
Abstract

A system and method for forming photoresists over semiconductor substrates is provided. An embodiment comprises a photoresist with a concentration gradient. The concentration gradient may be formed by using a series of dry film photoresists, wherein each separate dry film photoresist has a different concentration. The separate dry film photoresists may be formed separately and then placed onto the semiconductor substrate before being patterned. Once patterned, openings through the photoresist may have a tapered sidewall, allowing for a better coverage of the seed layer and a more uniform process to form conductive materials through the photoresist.

Claims (37)

1. A semiconductor device comprising:

a substrate; and

a photoresist over the substrate, the photoresist comprising photoactive compounds, the photoactive compounds having a concentration gradient, wherein the concentration of the photoactive compounds is different at different distances from the substrate.

2. The semiconductor device of claim 1 , wherein the substrate further comprises:

a first semiconductor substrate; and

a die over the first semiconductor substrate.

3. The semiconductor device of claim 1 , wherein the photoresist further comprises:

a first layer of photoresist with a first concentration of photoactive compounds; and

a second layer of photoresist with a second concentration of photoactive compounds, the second concentration being less than the first concentration.

4. The semiconductor device of claim 3 , wherein the first concentration is a concentration to reach a desired critical dimension.

5. The semiconductor device of claim 3 , wherein the photoresist further comprises:

a third layer of photoresist with a third concentration of photoactive compounds, the third concentration being less than the second concentration; and

a fourth layer of photoresist with a fourth concentration of photoactive compounds, the fourth concentration being less than the third concentration.

6. The semiconductor device of claim 1 , wherein the concentration gradient has a reduction in concentration as the photoresist extends away from the substrate.

7. The semiconductor device of claim 1 , further comprising an opening through the photoresist, the opening having a tapered sidewall.

8. The semiconductor device of claim 1 , wherein the concentration gradient has a step profile.

9. A semiconductor device comprising:

a first layer of photoresist over a substrate; and

a second layer of photoresist over the first layer of photoresist, the first layer of photoresist and the second layer of photoresist having a concentration gradient of photoactive compounds, wherein the first layer of photoresist has a first concentration of photoactive compounds and the second layer of photoresist has a second concentration of photoactive compounds different from the first concentration of photoactive compounds.

10. The semiconductor device of claim 9 , wherein the second layer of photoresist has a lower concentration of photoactive compounds than the first layer of photoresist.

11. The semiconductor device of claim 9 , wherein the substrate further comprises:

a first semiconductor substrate; and

a die over the first semiconductor substrate.

12. The semiconductor device of claim 9 , further comprising a third layer of photoresist over the second layer of photoresist, the third layer of photoresist having a lower concentration of photoactive compounds than the second layer of photoresist.

13. The semiconductor device of claim 9 , wherein the concentration of photoactive compounds between the first layer of photoresist and the second layer of photoresist has a step profile.

14. The semiconductor device of claim 9 , further comprising an opening through the second layer of photoresist, the opening having a tapered sidewall.

15. A semiconductor device comprising:

a substrate;

a first layer over the substrate, the first layer comprising a first concentration of photoactive compounds; and

a second layer over and in physical contact with the first layer, the second layer comprising a second concentration of photoactive compounds, wherein the first concentration and the second concentration are part of a concentration gradient.

16. The semiconductor device of claim 15 , wherein the substrate further comprises:

a first semiconductor substrate; and

a die over the first semiconductor substrate.

17. The semiconductor device of claim 15 , further comprising a third layer over and in physical contact with the second layer, the third layer having a third concentration of photoactive compounds, the third concentration being less than the second concentration.

18. The semiconductor device of claim 17 , further comprising a fourth layer over and in physical contact with the third layer, the fourth layer having a fourth concentration of photoactive compounds, the fourth concentration being less than the third concentration.

19. The semiconductor device of claim 15 , further comprising an opening through the second layer, the opening having a tapered sidewall.

20. The semiconductor device of claim 15 , wherein the first layer is a dry film photoresist.

Assignments (2)
RELEASE OF SECURITY INTEREST Recorded Jun 26, 2025
From: BANK LEUMI LE-ISRAEL B.M.
To: ALGOSEC SYSTEMS LTD.
Reel/Frame 071726/0682 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2011
From: YU, CHEN-HUA; LIU, CHUNG-SHI; KUO, HUNG-JUI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026663/0953 →
Continuity (1)
Related Publication 20130026644A1 · Jan 31, 2013