LIGHT-EMITTING DEVICE WITH TEMPERATURE COMPENSATION
The present application provides a light-emitting device comprising a light-emitting diode group, a temperature compensation element electrically connected to the light-emitting diode group. When a junction temperature of the light-emitting diode group is increased from a first temperature to a second temperature during operation, the current flowing through the light-emitting diode group at the second temperature is larger than the current flowing through the light-emitting diode group at the first temperature.
1 . A light-emitting device, comprising:
a first light-emitting diode group with a first hot/cold factor comprising a plurality of first light-emitting diode units electrically connected to one another, wherein the junction temperature of the first light-emitting diode group is increased from a first temperature to a second temperature during operation; and
a temperature compensation element electrically connected to the first light-emitting diode group so the current flowing through the first light-emitting diode group at the second temperature is larger than the current flowing through the first light-emitting diode group at the first temperature.
2 . The light-emitting device as claimed in claim 1 , wherein the temperature compensation element is a thermal resistor with positive temperature coefficient, and is connected to the first light-emitting diode group in parallel.
3 . The light-emitting device as claimed in claim 1 , wherein the temperature compensation element is a thermal resistor with negative temperature coefficient, and is connected to the first light-emitting diode group in series.
4 . The light-emitting device as claimed in claim 1 , wherein the first light-emitting diode unit is a red light light-emitting diode.
5 . The light-emitting device as claimed in claim 1 , wherein the first light-emitting diode group comprises a substrate, and the first light-emitting diode units are collectively formed on the substrate to form a high voltage single chip.
6 . The light-emitting device as claimed in claim 1 further comprising a board, wherein the first light-emitting diode group is formed on the board.
7 . The light-emitting device as claimed in claim 6 further comprising a second light-emitting diode group formed on the board, having a second hot/cold factor larger than the first hot/cold factor, and comprising a plurality of second light-emitting diode units electrically connected to one another.
8 . The light-emitting device as claimed in claim 1 , wherein the first hot/cold factor is no more than 0.85.
9 . The light-emitting device as claimed in claim 7 , wherein the second hot/cold factor is not less than 0.85.
10 . The light-emitting device as claimed in claim 7 , wherein the second light-emitting diode unit is a blue light light-emitting diode.
11 . The light-emitting device as claimed in claim 7 , wherein the second light-emitting diode group comprises a substrate, and the second light-emitting diode units are collectively formed on the substrate to form a high voltage single chip.
12 . The light-emitting device as claimed in claim 7 , wherein the first light-emitting diode group is electrically connected to the second light-emitting diode group.
13 . The light-emitting device as claimed in claim 6 , wherein the temperature compensation element is formed on the board.