IP Library Granted Patent US 8,746,915
Granted Patent B2
US 8,746,915 · App. 13/194,641 · Granted Jun 10, 2014

Light emitting die (LED) lamps, heat sinks and related methods

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,746,915
App. No.
13/194,641
Granted
Jun 10, 2014
Kind
B2
Abstract

Light-emitting die (LED) Lamps, heat sinks, and related methods are provided. An LED lamp can include a mounting substrate having a top surface, a bottom surface and side edges. An LED package can be disposed on the top surface of the mounting substrate with the LED package comprising an LED chip. The LED lamp can include a heat sink that can include a heat sink base and a spacer extending upward from the base. The spacer can have a mounting area or pad distal from the heat sink base on which the bottom surface of the mounting substrate is disposed. The spacer can also have a width that is less than a width between the side edges of the mounting substrate. The LED lamp can further include a lens disposed over the LED package and the mounting substrate.

Claims (20)

1. A light-emitting die (LED) lamp comprising:

a heat sink comprising a heat sink base and a spacer, the spacer comprising a mounting area that is distal to the heat sink base and disposed along a plane that is substantially parallel to the base;

an LED mounted over the mounting area of the spacer; and

a first lens disposed over the LED and portions of the spacer, wherein a bottom portion of the first lens extends to a distance beyond a width of the spacer for transmitting light from the LED both above and below the plane of the mounting area of the spacer.

2. The LED lamp of claim 1 , wherein the LED comprises an LED package.

3. The LED lamp of claim 2 , wherein the LED package comprises an LED package lens.

4. The LED lamp of claim 3 further comprising an outer lens disposed over the LED package, the first lens and the spacer.

5. The LED lamp of claim 1 , further comprising a mounting substrate on the mounting area of the spacer and the LED mounted on the mounting substrate, and wherein the first lens extends beyond the mounting substrate.

6. The LED lamp of claim 5 , wherein the mounting substrate comprises a metal core printed circuit board (MCPCB).

7. The LED lamp of claim 1 , further comprising an outer lens disposed over the LED, the first lens and the spacer.

8. The LED lamp of claim 7 , wherein the outer lens comprises a glass enclosure for reflecting light in a manner that causes the light to resemble a flickering flame.

9. The LED lamp of claim 1 , further comprising an electrical base attached to the heat sink and configured to engage a light fixture and a driver in electrical connection with the LED and the electrical base.

10. The LED lamp of claim 1 , wherein the heat sink comprises a plurality of pins.

11. The LED lamp of claim 10 , wherein the heat sink comprises a heat sink base having a top surface, a bottom surface and at least one side edge and the spacer comprises a first and second end, the spacer being attached to the top surface of the heat sink base at the first end and extending upward therefrom and the mounting area of the spacer being on the second end and wherein the plurality of pins are spaced apart and attached to the bottom surface of the heat sink base and extend downwardly therefrom, the plurality of pins creating an interior cavity in which a driver resides.

12. The LED lamp of claim 11 , further comprising a protective cylinder disposed between the plurality of pins and the driver.

13. The LED lamp of claim 11 , wherein the heat sink base has a diameter of approximately 32 mm or more.

14. The LED lamp of claim 11 , wherein the heat sink base has an aperture therethrough through which wires are passable to connect a driver to the LED package.

15. The LED lamp of claim 1 , wherein the light from the LED transmitted through the first lens above and below the plane of the mounting area of the spacer has a radius that is greater than approximately 180°.

16. The LED lamp of claim 1 , wherein the light from the LED transmitted through the first lens above and below the plane of the mounting area of the spacer has a radius that is approximately 270° or greater.

17. The LED lamp of claim 1 wherein the lamp is configured to be a candelabra lamp.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2025
From: INTENSITY LIGHTING COMPANY, LLC
To: PROSPERINA VENTURES LLC
Reel/Frame 072589/0422 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: CREE LIGHTING USA LLC
To: INTENSITY LIGHTING COMPANY, LLC
Reel/Frame 071911/0089 →
SECURITY INTEREST Recorded Sep 13, 2023
From: IDEAL INDUSTRIES LIGHTING LLC
To: FGI WORLDWIDE LLC
Reel/Frame 064897/0413 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 20, 2019
From: CREE, INC.
To: IDEAL INDUSTRIES LIGHTING LLC
Reel/Frame 049534/0370 →