Shielded USB connector module with molded hood and LED light pipe
View Patent ↗There is provided a system and method for a shielded connector module with a molded hood and an LED light pipe. There is provided a shielded connector module comprising a system-in-package (SiP) device having a surface mounted light emitting diode (LED), a metallic shield surrounding the SiP device, a molded hood surrounding the metallic shield, and an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the metallic shield and the molded hood. By designing the LED light pipe with a concave surface for surrounding the surface mounted LED and by using various techniques to reduce a gap between the LED and the light pipe, light capture and transmission may be optimized for easily viewable high intensity light. A fresnel lens may be optionally attached to the light pipe for wider viewing angles.
1. A shielded connector module comprising:
a system-in-package (SIP) device having a surface mounted light emitting diode (LED) on a top surface of the SiP device;
a metallic shield surrounding the SiP device and having a first hole above the top surface of the SiP device;
a molded hood surrounding the metallic shield and having a second hole above the first hole;
an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the first hole in the metallic shield and the second hole in the molded hood.
2. The shielded connector module of claim 1 , wherein the SiP device includes contacts for a Universal Serial Bus (USB) connection.
3. The shielded connector module of claim 1 , wherein the molded hood comprises opaque materials.
4. The shielded connector module of claim 1 , wherein the LED light pipe includes a fresnel lens on a surface thereof that is exposed outside of the molded hood.
5. The shielded connector module of claim 1 , wherein the LED light pipe comprises optical grade acrylic materials.
6. The shielded connector module of claim 1 , wherein the LED light pipe is secured in place by a locking shoulder.
7. The shielded connector module of claim 1 , wherein the LED light pipe is secured in place by an annular ring.
8. The shielded connector module of claim 1 , wherein the LED light pipe includes a concave surface surrounding the surface mounted LED.
9. The shielded connector module of claim 8 , wherein the proximity of the LED light pipe to the surface mounted LED is no greater than 0.05 inches or 1.27 mm.
10. The shielded connector module of claim 8 , wherein a gap between the concave surface and the surface mounted LED is filled with an optically translucent epoxy.
11. A method of creating a shielded connector module, the method comprising:
providing a system-in-package (SIP) device having a surface mounted light emitting diode (LED) on a top surface of the SiP device;
surrounding the SiP device with a metallic shield having a first hole above the top surface of the SiP device;
forming a molded hood around the metallic shield having a second hole above the first hole;
inserting an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the first hole in the metallic shield and the second hole in the molded hood.
12. The method of claim 11 , further comprising, prior to the forming of the molded hood:
molding the molded hood and the LED light pipe in a dual-shot molding operation.
13. The method of claim 11 , wherein the SiP device includes contacts for a Universal Serial Bus (USB) connection.
14. The method of claim 11 , wherein the molded hood comprises opaque materials.
15. The method of claim 11 , wherein the LED light pipe includes a fresnel lens on a surface thereof that is exposed outside of the molded hood.
16. The method of claim 11 , wherein the inserting of the LED light pipe is secured in place by a locking shoulder.
17. The method of claim 11 , wherein the inserting of the LED light pipe is secured in place by an annular ring.
18. The method of claim 11 , wherein the LED light pipe includes a concave surface surrounding the surface mounted LED.
19. The method of claim 18 , wherein the proximity of the LED light pipe to the surface mounted LED is no greater than 0.05 inches or 1.27 mm.
20. The method of claim 18 , wherein a gap between the concave surface and the surface mounted LED is filled with an optically translucent epoxy.