MEMS integrated circuit having backside integrated circuit contacts
View Patent ↗A MEMS integrated circuit includes a silicon substrate having a frontside with a drive circuitry layer and a backside. A MEMS layer is disposed on the drive circuitry layer. The MEMS layer includes a plurality of MEMS devices electrically connected to the drive circuitry layer. Integrated circuit contacts are positioned at a backside of the substrate. The integrated circuit contacts are electrically connected to the drive circuitry layer via respective connector rods extending through the substrate.
1. A MEMS integrated circuit comprising:
a substrate having a frontside and a backside, said frontside comprising a drive circuitry layer;
a MEMS layer disposed on said drive circuitry layer, said MEMS layer comprising a plurality of MEMS devices electrically connected to said drive circuitry layer; and
one or more integrated circuit contacts positioned at said backside of said substrate, wherein said integrated circuit contacts are electrically connected to said drive circuitry layer via respective connector rods extending through said substrate.
2. The MEMS integrated circuit of claim 1 , wherein each connector rod extends from the drive circuitry layer to a respective integrated circuit contact, said integrated circuit contact being 15 defined by an end of the connector rod.
3. The MEMS integrated circuit of claim 1 , wherein each connector rod extends from a contact pad disposed in or on a roof of the MEMS layer to a respective integrated circuit contact, said integrated circuit contact being defined by an end of the connector rod.
4. The MEMS integrated circuit of claim 3 , wherein one or more connector posts extend from said drive circuitry layer to said contact pad, such that said drive circuitry layer is electrically connected to said integrated circuit contacts via the connector posts, the contact pad and the connector rods.
5. The MEMS integrated circuit of claim 1 , wherein said integrated circuit contacts are contained in a backside recessed portion of said substrate.
6. The MEMS integrated circuit of claim 5 , wherein said recessed portion is defined along a longitudinal edge region of said MEMS integrated circuit.
7. The MEMS integrated circuit of claim 1 , wherein each connector rod is tapered towards said backside.
8. The MEMS integrated circuit of claim 1 , wherein each connector rod is comprised of copper.
9. The MEMS integrated circuit of claim 1 , wherein each connector rod has outer sidewalls comprising an insulating film.
10. The MEMS integrated circuit of claim 9 , wherein said outer sidewalls comprise a diffusion barrier layer between said insulating film and a conductive core of said connector rod.
11. The MEMS integrated circuit of claim 1 , wherein said drive circuitry layer is a CMOS layer.
12. The MEMS integrated circuit of claim 1 , wherein said MEMS layer comprises a plurality of inkjet nozzle assemblies, such that said MEMS integrated circuit defines a printhead integrated circuit.
13. The MEMS integrated circuit of claim 12 , wherein each inkjet nozzle assembly comprises an actuator.
14. The MEMS integrated circuit of claim 13 , wherein each actuator is comprised of the same material as a contact pad disposed in or on a roof of the MEMS layer.
15. The MEMS integrated circuit of claim 12 , wherein said backside has a plurality of ink supply channels extending longitudinally along the MEMS integrated circuit, each ink supply channel defining one or more ink inlets for receiving ink from an ink supply manifold, wherein each ink supply channel supplies ink to a plurality of frontside inlets, and each frontside inlet supplies ink to one or more of said inkjet nozzle assemblies.
16. The MEMS integrated circuit of claim 15 , wherein each ink supply channel has a depth corresponding to a depth of a backside recessed portion containing the integrated circuit contacts.