IP Library › Patent Application 13197762
Patent Application
App. No. 13/197,762

INSPECTION APPARATUS AND INSPECTION METHOD

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Quick Facts
Patent No.
US None
App. No.
13/197,762
Abstract

An inspection apparatus includes a wafer stage for carrying a wafer, an illumination module which irradiates an inspection beam on the wafer carried on the wafer stage, a detection module which detects scattering rays or reflection rays from the wafer on the wafer stage and outputs an image signal, a coordinates control module which stores information about the arrangement of individual inspection areas on the wafer, and an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in the coordinates control module, an imperfect inspection area interfering with a wafer edge.

Claims (7)

1 . An inspection apparatus comprising:

a wafer stage for carrying a wafer;

an illumination module which irradiates an inspection beam on the wafer carried on said wafer stage;

a detection module which detects scattering rays or reflection rays from the wafer on said wafer stage and outputs an image signal;

a coordinates control module which stores information about the arrangement of individual inspection areas on said wafer; and

an imperfect area recognition module which recognizes, on the basis of the inspection area arrangement information stored in said coordinates control module, an imperfect inspection area interfering with a wafer edge.

2 - 17 . (canceled)