IP Library Granted Patent US 8,723,505
Granted Patent B2
US 8,723,505 · App. 13/198,207 · Granted May 13, 2014

Current sensor structure

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Quick Facts
Patent No.
US 8,723,505
App. No.
13/198,207
Granted
May 13, 2014
Kind
B2
Abstract

A current sensor structure includes a substantially ring-shaped magnetic core comprising layers of magnetic plates to be accommodated in an insulating case and secured to the case via a molding compound. Projections protruding in the magnetic plate's thickness direction are provided either on a front-side wall portion of the case in the thickness direction or on a surface of the magnetic core in the thickness direction. By virtue of, the surface of the magnetic core is supported by the front-side wall portion via the projections, leaving a gap between this surface and the wall portion to the same height as that of the projections. The gap is filled with the molding compound. Dilative and contractive deformation of the case in the direction orthogonal to the thickness direction is absorbed by the molding compound in the gap to prevent the stress from acting upon the magnetic core.

Claims (6)

1. A current sensor structure adapted to accommodate a substantially ring-shaped magnetic core comprising layers of magnetic plates in an insulating case, the magnetic core being secured to the case using a molding compound, the current sensor structure comprising:

(a) a plurality of projections provided either on a wall portion of the case in a magnetic plate's thickness direction or on a surface of the magnetic core in the magnetic plate's thickness direction, the projections protruding in the magnetic plate's thickness direction such that the surface of the magnetic core is supported by the wall portion via the projections; and

(b) a gap provided between the surface of the magnetic core and the wall portion of the case, the gap having a same height as that of the projections, and being adapted to be filled with the molding compound such that dilative and contractive deformations of the case in a direction orthogonal to the magnetic plate's thickness direction is absorbed by the molding compound within the gap and thereby a stress is prevented from acting upon the magnetic core.

2. The current sensor structure as set forth in claim 1 , wherein the projections are three in number each provided at corresponding each of apexes of a virtual triangle.

3. The current sensor structure as set forth in claim 1 , wherein the projections of the case are resin-molded on the case in one piece therewith.

4. The current sensor structure as set forth in claim 1 , wherein the magnetic plates each have a projection on a front surface thereof and a recess on a reverse side thereof, the projection being configured to be brought into fitting engagement with the recess of adjacent one of the magnetic plates, and the projection of the magnetic plate constituting the surface of the magnetic core is brought into abutment on the wall portion of the case.

Assignments (2)
CHANGE OF ADDRESS Recorded Jun 5, 2023
From: YAZAKI CORPORATION
To: YAZAKI CORPORATION
Reel/Frame 063845/0802 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2011
From: SAKAMOTO, AKINORI; KAWAGUCHI, YASUNORI
To: YAZAKI CORPORATION
Reel/Frame 026702/0578 →