Systems and methods for forming MEMS assemblies incorporating getters
View Patent ↗Systems and methods for forming MEMS assemblies incorporating getters are described. One such method for forming and bonding to a microelectromechanical systems (MEMS) assembly includes providing a first MEMS wafer including a metal layer on an inner surface and one or more cavities for forming a MEMS component, attaching a MEMS capping wafer, having at least one through hole via, to the inner surface of the first MEMS wafer thereby forming at least one encapsulated MEMs component within the first MEMS wafer, and bonding a wire to the metal layer through an open end of the at least one through hole via.
1. A microelectromechanical systems (MEMS) assembly comprising:
a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;
a MEMS capping wafer attached to the metal layer of the first MEMS wafer, the MEMS capping wafer having at least one through hole via, thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and
a wire bonded to the metal layer through an open end of the at least one through hole via,
wherein a first cavity of the one or more cavities comprises a first conductive pad,
wherein a second cavity of the one or more cavities comprises a second conductive pad, and
wherein each of the first and second conductive pads comprises a getter material.
2. The assembly of claim 1 :
wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and
wherein the one or more electrodes are attached to the metal layer of the first MEMS wafer.
3. The assembly of claim 2 , wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities.
4. The assembly of claim 1 , wherein the getter material comprises a metal selected from the group consisting of Ti and Cr.
5. The assembly of claim 1 , wherein the MEMS assembly forms one or more accelerometers.
6. The assembly of claim 1 , wherein the wire comprises a ball formed of a portion of the wire, wherein the ball is bonded to the metal layer through the open end of the at least one through hole via.
7. The assembly of claim 1 :
wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer, and
wherein the inner surface of the MEMS capping wafer comprises oxide.
8. A microelectromechanical systems (MEMS) assembly comprising:
a first MEMS wafer comprising a metal layer on an inner surface and one or more cavities for forming a MEMS component;
a MEMS capping wafer attached to the metal layer of the first MEMS wafer, the MEMS capping wafer having at least one through hole via, thereby forming at least one encapsulated MEMs component within the first MEMS wafer; and
a wire bonded to the metal layer through an open end of the at least one through hole via,
wherein the MEMS capping wafer comprises an inner surface and an outer surface, and one or more electrodes positioned along the inner surface of the MEMS capping wafer,
wherein the one or more electrodes are attached to the metal layer of the first MEMS wafer,
wherein a first electrode of the one or more electrodes is positioned between a first through hole via of the at least one through hole via and a first cavity of the one or more cavities, and
wherein a second electrode of the one or more electrodes is positioned between a second through hole via of the at least one through hole via and a second cavity of the one or more cavities.
9. The assembly of claim 8 , wherein the first electrode and the second electrode are electrically isolated.