Organic layer deposition apparatus

1. A method of forming an organic layer on a substrate of an organic light-emitting display apparatus within a vacuum chamber, the method comprising:

arranging the substrate to face an organic layer deposition apparatus; and

discharging a deposition material via a deposition source of the organic layer deposition apparatus onto the substrate;

wherein a deposition source nozzle unit of the organic layer deposition apparatus is located at a side of the deposition source, the deposition source nozzle unit including a plurality of deposition source nozzles arranged in a first direction;

wherein a patterning slit sheet of the organic layer deposition apparatus is located to be between the deposition source nozzle unit and the substrate, the patterning slit sheet having a plurality of patterning slits arranged in a second direction perpendicular to the first direction, all the plurality of pattern slits being extended in the first direction;

wherein an interval measuring unit of the organic layer deposition apparatus is located in the vacuum chamber and configured to measure a distance between the substrate and the patterning slit sheet; and

wherein the organic layer deposition apparatus is configured to perform deposition while the substrate or the organic layer deposition apparatus is moved relative to the other in the first direction at a distance from the other so that the patterning slit sheet provides a plurality of lines of the discharged deposition material along the first direction on the substrate.

2. The method of claim 1 , wherein the deposition source, the deposition source nozzle unit, and the patterning slit sheet are integrally formed as a single body.

3. The method of claim 1 , wherein the deposition source, the deposition source nozzle unit, and the patterning slit sheet are integrally connected as a single body by a connection member for guiding movement of the deposition material.

4. The method of claim 3 , wherein the connection member seals a space between the deposition source nozzle unit located at the side of the deposition source, and the patterning slit sheet.

5. The method of claim 1 , wherein the plurality of deposition source nozzles are tilted at an angle with respect to a vertical line of a surface from which the deposition source nozzle is extruded.

6. The method of claim 5 , wherein the plurality of deposition source nozzles comprises deposition source nozzles arranged in two rows formed in the first direction, and the deposition source nozzles in one of the two rows are tilted to face towards the deposition source nozzles in the other one of the two rows.

7. The method of claim 5 , wherein the plurality of deposition source nozzles comprises deposition source nozzles arranged in two rows formed in the first direction,

the deposition source nozzles of one of the two rows located at a first side of the patterning slit sheet are arranged to face towards a second side of the patterning slit sheet, and

the deposition source nozzles of the other one of the two rows located at the second side of the patterning slit sheet are arranged to face towards the first side of the patterning slit sheet.

8. The method of claim 1 , wherein the interval measuring unit is configured to measure the distance between the substrate and the patterning slit sheet in a vacuum condition.

9. The method of claim 1 , wherein the interval measuring unit is located above the substrate, and a sensing pattern to be sensed by the interval measuring unit is on one surface of the substrate.

10. The method of claim 9 , wherein the interval measuring unit is configured to sense the sensing pattern from the moving substrate and then to sense one surface of the patterning slit sheet to measure the interval between the substrate and the patterning slit sheet.

11. The method of claim 9 , wherein the sensing pattern is formed of metal.

12. The method of claim 9 , wherein the interval measuring unit is a capacitive sensor or an Eddy-current sensor.

13. The method of claim 9 , wherein the interval measuring unit is located below the patterning slit sheet,

the sensing pattern to be sensed by the interval measuring unit is located on one surface of the substrate, and

the patterning slit sheet has a through hole, and comprises a sensing target configured to cover the through hole.

14. The method of claim 13 , wherein the sensing target and the sensing pattern are formed of metal.

15. The method of claim 13 , wherein the interval measuring unit is configured to sense the sensing target and then to sense the sensing pattern from the moving substrate through the through hole from which the sensing target has been removed, to measure the interval between the substrate and the patterning slit sheet.

16. The method of claim 13 , wherein the interval measuring unit is a capacitive sensor or an Eddy-current sensor.

17. The method claim 1 , wherein the interval measuring unit is located above the substrate and is configured to sense one surface of the substrate and one surface of the patterning slit sheet so as to measure the distance between the substrate and the patterning slit sheet.

18. The method of claim 17 , wherein the interval measuring unit is a confocal sensor.

19. The method of claim 1 , wherein the interval measuring unit is located below the patterning slit sheet, and the patterning slit sheet has a through hole.

20. The method of claim 19 , wherein the interval measuring unit is configured to sense one surface of the patterning slit sheet and to sense one surface of the substrate through the through hole so as to measure the interval between the substrate and the patterning slit sheet.

21. The method of claim 19 , wherein the interval measuring unit is a confocal sensor.