Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting device, and nitride semiconductor transistor device
View Patent ↗Example embodiments herein relate to a nitride semiconductor light emitting device including a coat film formed at a light emitting portion and including an aluminum nitride crystal or an aluminum oxynitride crystal, and a method of manufacturing the nitride semiconductor light emitting device. Also provided is a nitride semiconductor transistor device including a nitride semiconductor layer and a gate insulating film which is in contact with the nitride semiconductor layer and includes an aluminum nitride crystal or an aluminum oxynitride crystal.
1. A method of manufacturing a nitride semiconductor light emitting device including a coat film formed at a light emitting portion, the method comprising:
forming said coat film including an aluminum oxynitride crystal at said light emitting portion by electron beam evaporation or sputtering in a deposition room,
wherein said coat film is formed by oxidizing at least a part of an aluminum target to form an oxidized target prior to the electron beam evaporation or sputtering and not introducing oxygen gas into said deposition room after the oxidizing and during the electron beam evaporation or sputtering of the oxidized target.
2. The method of claim 1 , wherein the oxidizing results in an aluminum oxide target on a surface of the aluminum target.
3. The method of claim 1 , wherein the oxidizing is performed with oxygen plasma.
4. The method of claim 3 , wherein the oxygen plasma is generated by exposing oxygen gas to microwaves.
5. The method of claim 1 , further comprising:
introducing a nitrogen plasma into the deposition room after the oxidizing to facilitate the electron beam evaporation or sputtering.
6. The method of claim 5 , wherein the nitrogen plasma is generated by exposing nitrogen gas to microwaves.
7. The method of claim 5 , further comprising:
introducing an argon plasma together with the nitrogen plasma into the deposition room after the oxidizing to facilitate the electron beam evaporation or sputtering.
8. The method of claim 7 , wherein the argon plasma is generated by exposing argon gas to microwaves.