Method of manufacturing component embedded printed circuit board

1. A method of manufacturing an optical component embedded printed circuit board, the method comprising:

stacking a first insulation layer on a first surface of a metal core;

embedding an optical component in a cavity formed in the metal core, the first insulation layer having at least a first region exposed by the cavity and a second region being in contact with the metal core;

stacking a second insulation layer of a transparent material on a second surface of the metal core opposite to the first surface; and

forming a circuit pattern on the first insulation layer, the circuit pattern electrically connected with the optical component,

the forming the circuit pattern comprising forming a via in the second region of the first insulation layer to thermally connect the metal core with the circuit pattern.

2. The method of claim 1 , further comprising, between stacking the first insulation layer and embedding the optical component:

removing a portion of the metal core to form the cavity.

3. The method of claim 1 , further comprising, before stacking the first insulation layer:

forming a plating layer on one side of the metal core at a position where the optical component is to be embedded.

4. The method of claim 3 , further comprising, between stacking the first insulation layer and embedding the optical component:

removing a portion of the metal core to form the cavity.

5. The method of claim 1 , further comprising, before stacking the first insulation layer:

removing a portion of the metal core to form the cavity.

6. The method of claim 1 , further comprising, after forming the circuit pattern:

forming a circuit pattern on the second insulation layer.

7. The method of claim 1 , wherein forming the circuit pattern further comprises: forming another via in the first region of the first insulation layer to contact the optical component with the circuit pattern.