IP Library Granted Patent US 8,611,000
Granted Patent B2
US 8,611,000 · App. 13/205,156 · Granted Dec 17, 2013

Electro-optical display device and process for manufacturing the same

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Quick Facts
Patent No.
US 8,611,000
App. No.
13/205,156
Granted
Dec 17, 2013
Kind
B2
Abstract

An electro-optical display device includes a first substrate having an pixel electrode, a light-transmissive second substrate having a light-transmissive counter electrode, an electrophoretic layer interposed between the first substrate and the second substrate and having a liquid dispersion, a partition wall that defines a plurality of reservoirs containing the dispersion and a light-transmissive sealing layer that is provided between the partition wall and the counter electrode so as to seal the dispersion, and a light-transmissive hot melt conductive adhesive layer provided between the sealing layer and the counter electrode.

Claims (24)

1. An electro-optical display device comprising:

a first substrate having a first electrode;

a light-transmissive second substrate having a light-transmissive second electrode;

an electrophoretic layer interposed between the first substrate and the second substrate, the electrophoretic layer having a liquid electro-optical material, a partition wall that defines a plurality of reservoirs containing the electro-optical material, and a light-transmissive sealing layer that is provided between the partition wall and the second electrode so as to seal the electro-optical material; and

a light-transmissive hot melt conductive adhesive layer provided between the sealing layer and the second electrode,

the light-transmissive hot melt conductive adhesive layer does not include solvent, and

the light-transmissive hot melt conductive adhesive layer including conductive fillers, wherein said conductive filler is selected from: (1) glass beads that have been surface-treated with inorganic salts or (2) silicon compounds.

2. The electro-optical display device according to claim 1 , wherein the light-transmissive hot melt conductive adhesive layer softens at a temperature in the range of 80° C. to 100° C.

3. The electro-optical display device according to claim 1 , wherein the light-transmissive hot melt conductive adhesive layer has a resistivity in the thickness direction of not more than 1000 Ω.

4. The electro-optical display device according to claim 3 , wherein the light-transmissive hot melt conductive adhesive layer has a resistivity in the thickness direction of not more than 500 Ω.

5. The electro-optical display device according to claim 1 , wherein the light-transmissive hot melt conductive adhesive layer has a thickness in the range of 1 μm to 50 μm.

6. The electro-optical display device according to claim 1 , wherein the light-transmissive hot melt conductive adhesive layer is formed of a material including a mixture of a binder resin and a conductive material.

7. The electro-optical display device according to claim 6 , wherein the concentration of the conductive material is 5 to 50 wt % of the light-transmissive hot melt conductive adhesive layer.

8. A process for manufacturing electro-optical display devices, comprising:

providing a plurality of partition walls on a plate base having a plurality of spaces that are open on an opposite side of the base plate;

supplying a liquid electro-optical material into the spaces between the plurality of partition walls; and

forming a sealing layer on the opposite side of the base plate through which the electro-optical material has been supplied into the spaces, thereby forming an electrophoretic layer;

laminating a first substrate having a pixel electrode to the base plate; and

laminating a second substrate having a second electrode to the opposite side of the base plate through melting a light-transmissive hot melt conductive adhesive layer by heating, wherein

the light-transmissive hot melt conductive adhesive layer does not include solvent, and

the light-transmissive hot melt conductive adhesive layer includes conductive fillers, wherein said conductive filler is selected from: (1) glass beads that have been surface-treated with inorganic salts or (2) silicon compounds.

9. The process for manufacturing electro-optical display devices according to claim 8 , wherein the laminating of the second substrate is performed at a lamination temperature in the range of 80° C. to 100° C.

10. The process for manufacturing electro-optical display devices according to claim 8 , further comprising:

forming the light-transmissive hot melt conductive adhesive layer by supplying a hot melt conductive adhesive film to the surface of the second electrode opposite the second substrate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 13, 2018
From: SEIKO EPSON CORPORATION
To: E INK CORPORATION
Reel/Frame 047072/0325 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2011
From: KOMATSU, HARUNOBU; SHITAGAMI, KOZO
To: SEIKO EPSON CORPORATION
Reel/Frame 026731/0713 →