IP Library Granted Patent US 8,691,125
Granted Patent B2
US 8,691,125 · App. 13/206,096 · Granted Apr 8, 2014

Injection molding apparatus and method for manufacturing long molded article

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Quick Facts
Patent No.
US 8,691,125
App. No.
13/206,096
Granted
Apr 8, 2014
Kind
B2
Abstract

An injection molding apparatus includes a first mold and a second mold, a cavity formed by clamping the first mold and the second mold, and includes a portion where the ratio of a first dimension and a second dimension changes continuously such that a portion where the ratio of the first dimension of a pair of first surfaces, and the second dimension of a pair of second surfaces becomes 1 locates in an intermediate portion of the cavity in a longitudinal direction of the long shape; and a first temperature adjusting circuit that is provided at the first mold and the second mold to adjust a temperature within a range where the second dimension of the second surfaces is greater than the first dimension of the first surfaces such that the temperature of the pair of first surfaces becomes higher than the temperature of the pair of second surfaces.

Claims (26)

1. An injection molding apparatus comprising:

a first mold;

a second mold that moves relative to the first mold;

the first mold and the second mold being clamped to form a cavity that has a long shape, and includes a portion where a ratio of a first dimension and a second dimension changes continuously such that the portion where the ratio of the first dimension of a pair of first surfaces that face each other along a mold opening direction in a section orthogonal to a longitudinal direction and the second dimension of a pair of second surfaces that face each other along a direction perpendicular to the mold opening direction becomes 1 locates in an intermediate portion of the cavity in a longitudinal direction of the long shape;

a first temperature adjusting circuit that is provided at the first mold and the second mold to adjust a temperature within a range where the second dimension of the second surfaces is greater than the first dimension of the first surfaces such that the temperature of the pair of first surfaces becomes higher than the temperature of the pair of second surfaces, wherein the first temperature adjusting circuit has a first surface circuit that adjusts the temperature of the pair of first surfaces, and a second surface circuit that adjusts the temperature of the pair of second surfaces, and has a heat-insulating structure between the first surface circuit and the second surface circuit; and

a second temperature adjusting circuit that is provided at the first mold and the second mold to adjust a temperature within a range where the second dimension of the second surfaces is smaller than the first dimension of the first surfaces such that the temperature of the pair of first surfaces within the range becomes lower than the temperature of the pair of first surfaces whose temperature is adjusted by the first temperature adjusting circuit.

2. The injection molding apparatus according to claim 1 ,

wherein the second surfaces of the first mold or the second mold are constructed to a movable nest.

3. An injection molding apparatus comprising:

a first mold;

a second mold that moves relative to the first mold;

the first mold and the second mold being clamped to form a cavity that has a long shape, and includes a portion where a ratio of a first dimension and a second dimension changes continuously such that the portion where the ratio of the first dimension of a pair of first surfaces that face each other along a mold opening direction in a section orthogonal to a longitudinal direction, and the second dimension of a pair of second surfaces that face each other along a direction perpendicular to the mold opening direction becomes 1 locates in an intermediate portion of the cavity in a longitudinal direction of the long shape;

a first temperature adjusting circuit that is provided at the first mold and the second mold to adjust a temperature within a range where the second dimension of the second surfaces is smaller than the first dimension of the first surfaces such that the temperature of the pair of second surfaces becomes higher than the temperature of the pair of first surfaces, wherein the first temperature adjusting circuit has a first surface circuit that adjusts the temperature of the pair of first surfaces, and a second surface circuit that adjusts the temperature of the pair of second surfaces, and has a heat-insulating structure between the first surface circuit and the second surface circuit; and

a second temperature adjusting circuit that is provided at the first mold and the second mold to adjust a temperature within a range where the second dimension of the second surfaces is greater than the first dimension of the first surfaces such that the temperature of the pair of second surfaces within the range becomes lower than the temperature of the pair of second surfaces whose temperature is adjusted by the first temperature adjusting circuit.

4. The injection molding apparatus according to claim 3 ,

wherein one of the pair of first surfaces is constructed to a movable nest.

5. A method for manufacturing a long molded article using the injection molding apparatus according to claim 1 , the method comprising:

adjusting the temperature of the cavity using the first temperature adjusting circuit and the second temperature adjusting circuit;

injecting molten resin into the cavity, and filling the cavity with the molten resin;

cooling and solidifying the molten resin in the cavity; and

opening the second mold.

6. A method for manufacturing a long molded article using the injection molding apparatus according to claim 3 , the method comprising:

adjusting the temperature of the cavity using the first temperature adjusting circuit and the second temperature adjusting circuit;

injecting molten resin into the cavity, and filling the cavity with the molten resin;

cooling and solidifying the molten resin in the cavity; and

opening the second mold.

Assignments (2)
CHANGE OF NAME Recorded Aug 12, 2021
From: FUJI XEROX CO., LTD.
To: FUJIFILM BUSINESS INNOVATION CORP.
Reel/Frame 058287/0056 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2011
From: MAEDA, HIROSHI
To: FUJI XEROX CO., LTD.
Reel/Frame 026732/0889 →