METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
1 . A method of packaging an electromechanical device, comprising:
providing a substrate with an electromechanical device formed thereon;
applying a curable adhesive on the substrate circumscribing the electromechanical device;
contacting a backplane with the curable adhesive to encapsulate the electromechanical device in a package structure formed by the substrate, the adhesive and the backplane; and
curing the adhesive to seal the package.
2 . The method of claim 1 , wherein the cured adhesive seal includes a low permeation rate adhesive.
3 . The method of claim 1 , wherein the electromechanical device includes a microelectromechanical (MEMS) device.
4 . The method of claim 3 , wherein the MEMS device is formed into an array.
5 . The method of claim 3 , wherein the MEMS device includes an interferometric modulator.
6 . The method of claim 1 , wherein the substrate includes a transparent substrate.
7 . The method of claim 6 , wherein the transparent substrate is formed of glass.
8 . The method of claim 1 further comprising positioning a getter inside the package structure.
9 . The method of claim 1 further comprising positioning a desiccant inside the package structure.
10 . An electromechanical systems device package, comprising:
an electromechanical systems device formed on a substrate;
a curable adhesive positioned on the substrate circumscribing the electromechanical systems device; and
a backplane contacting the curable adhesive and encapsulating the electromechanical device in a package formed between the substrate, the curable adhesive and the backplane.
11 . The electromechanical systems device package of claim 10 , wherein the curable adhesive is formed of a low outgassing material.
12 . The electromechanical systems device package of claim 10 , wherein the substrate, the curable adhesive and the backplane form a hermetic seal.
13 . The electromechanical systems device package of claim 10 , wherein the substrate includes a transparent substrate.
14 . The electromechanical systems device package of claim 16 , wherein the transparent substrate is formed of glass.
15 . The electromechanical systems device package of claim 10 further comprising a desiccant disposed inside the package.
16 . The electromechanical systems device package of claim 10 further comprising a getter disposed inside the package.
17 . The electromechanical systems device package of claim 10 further comprising a secondary seal in contact with the curable adhesive and formed of a hydrophobic material.
18 . An electromechanical systems device package, comprising:
an electromechanical systems device formed on a substrate;
a backplane; and
a cured adhesive contacting and sealing the backplane to the substrate to form a package, wherein the package encapsulates the electromechanical systems device.
19 . The electromechanical systems device package of claim 18 , wherein the electromechanical device includes a microelectromechanical (MEMS) device.
20 . The electromechanical systems device package of claim 19 , wherein the MEMS device is formed into an array.
21 . The electromechanical systems device package of claim 19 , wherein the MEMS device includes an interferometric modulator.