IP Library Granted Patent US 8,745,275
Granted Patent B2
US 8,745,275 · App. 13/209,994 · Granted Jun 3, 2014

Blade server apparatus

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Quick Facts
Patent No.
US 8,745,275
App. No.
13/209,994
Granted
Jun 3, 2014
Kind
B2
Abstract

A blade server apparatus including a plurality of server modules, a backplane for mounting the plurality of server modules thereon, and an SMP coupling device having wiring lines to SMP couple the plurality of server modules. Each of the server modules has one or more processors controlled by firmware and a module manager for managing its own server module, the module manager has an ID determiner for informing each processor of a processor ID, each processor has a processing unit and an SMP virtual connecting unit for instructing ones of wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted, and an ID converter for converting the processor ID and informing it to the SMP virtual connecting unit is provided within the firmware.

Claims (17)

1. A blade server apparatus comprising:

a plurality of server modules;

a backplane configured to mount the plurality of server modules; and

an SMP coupling device having wiring lines for SMP coupling between the plurality of server modules, wherein

each of the server modules has two processors controlled by firmware and a module manager configured to manage its own server module;

the module manager has an ID determiner configured to inform each processor of a processor ID;

each processor has a processing unit and an SMP virtual connecting unit configured to instruct one or more wiring lines of the SMP coupling device through which a packet received from the processing unit is to be transmitted;

an ID converter configured to convert the processor ID for the SMP virtual connecting unit is provided in the firmware,

wherein the ID determiner of the module manager is configured to:

receive a number of processors of an SMP arrangement from an SMP coupling type identification signal circuit within the SMP coupling device,

receive a slot number of each server module from a slot number identification signal circuit within the backplane, and

determine a processor ID of each processor; and

wherein the ID converter is configured to:

in such a case that the number of processors is eight, convert the processor ID determined by the ID determiner to a processor ID for the SMP virtual connecting unit according to an ID conversion table and notify the SMP virtual connecting unit; and

in such a case that the number of processors is two or four, notify the SMP virtual connecting unit of the processor ID having been determined by the ID determiner without conversion.

2. The blade server apparatus according to claim 1 , wherein the SMP coupling device is configured to SMP couple four of the server modules in such a manner that a longest wiring length of a wiring line SMP connected between the server modules is two times a server module mounting pitch.

3. The blade server apparatus according to claim 2 , wherein an electric characteristic of a substrate material of the SMP coupling device is set to be doubly improved over an electric characteristic of a substrate material of an SMP coupling device configured to SMP couple two server modules.

Assignments (2)
COMPANY SPLIT Recorded Aug 20, 2024
From: HITACHI, LTD.
To: HITACHI VANTARA, LTD.
Reel/Frame 069518/0761 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 22, 2011
From: IKEYA, AKIO; AOYAGI, TAKASHI; KASHIWAGI, KENJI; SEZAKI, NAOHIRO; NAKAJIMA, KAZUNORI
To: HITACHI, LTD.
Reel/Frame 026949/0894 →