Solid-state imaging device
A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.
1. A solid-state imaging device comprising:
a light-receiving sensor portion having a photoelectric conversion region, the photoelectric conversion region including a first-conductivity-type semiconductor region and a second-conductivity-type semiconductor region, the second-conductivity-type semiconductor region being on a surface of the first-conductivity-type semiconductor region:
an electrode to transfer a signal charge obtained from the light-receiving sensor portion;
a light-shielding film covering an image pickup area, including the electrode, except the light-receiving sensor portion; and
a voltage-applying portion separate from the light-shielding film, the voltage-applying portion positioned under the light-shielding film and spaced from the light-shielding film and the electrode by an insulation film,
wherein,
the photoelectric conversion region further includes a low impurity region that is on the surface of said first-conductivity-type region with the second-conductivity-type semiconductor region and that is in contact with the second-conductivity-type semiconductor region, the low impurity region having an impurity concentration that is lower than that of the second-conductivity-type semiconductor region, and
the voltage applying portion applies a voltage to the low impurity region to control a potential of the low impurity region, wherein the voltage-applying portion is not disposed above the electrode.
2. The solid-state imaging device of claim 1 , wherein the low impurity region and the second-conductivity-type semiconductor region occupy the entire surface of the first-conductivity-type region.
3. The solid-state imaging device of claim 1 , wherein the low impurity region and the voltage-applying portion are each in contact with the insulation film.