Method of forming polycrystalline silicon layer, and thin film transistor and organic light emitting device including the polycrystalline silicon layer
A method of forming a polycrystalline silicon layer includes forming a first amorphous silicon layer and forming a second amorphous silicon layer such that the first amorphous silicon layer and the second amorphous silicon layer have different film qualities from each other, and crystallizing the first amorphous silicon layer and the second amorphous silicon layer using a metal catalyst to form a first polycrystalline silicon layer and a second polycrystalline silicon layer. A thin film transistor includes the polycrystalline silicon layer formed by the method and an organic light emitting device includes the thin film transistor.
1. A method of forming a polycrystalline silicon layer, comprising:
forming a first amorphous silicon layer and a second amorphous silicon layer such that the first amorphous silicon layer and the second amorphous silicon layer have different film qualities from each other; and
crystallizing the first amorphous silicon layer and the second amorphous silicon layer using a metal catalyst to form a first polycrystalline silicon layer and a second polycrystalline silicon layer,
wherein the forming of the first amorphous silicon layer and the second amorphous silicon layer includes:
depositing the first amorphous silicon layer while providing a first gas with silane gas; and
depositing the second amorphous silicon layer while providing a second gas with silane gas,
wherein the first gas and the second gas are different gases and are different from silane gas.
2. The method as claimed in claim 1 , wherein the first polycrystalline silicon layer and the second polycrystalline silicon layer have different grain sizes from each other.
3. The method as claimed in claim 2 , wherein the second polycrystalline silicon layer has a smaller grain size than the first polycrystalline silicon layer.
4. The method as claimed in claim 1 , wherein an amount of the metal catalyst used in the first amorphous silicon layer and an amount of the metal catalyst used in the second amorphous silicon layer are substantially equivalent.
5. A method of forming a polycrystalline silicon layer, comprising:
forming a first amorphous silicon layer and a second amorphous silicon layer such that the first amorphous silicon layer and the second amorphous silicon layer have different film qualities from each other; and
crystallizing the first amorphous silicon layer and the second amorphous silicon layer using a metal catalyst to form a first polycrystalline silicon layer and a second polycrystalline silicon layer,
wherein:
the first polycrystalline silicon layer and the second polycrystalline silicon layer have different grain sizes from each other,
the second polycrystalline silicon layer has a smaller grain size than the first polycrystalline silicon layer,
the forming of the first amorphous silicon layer and the second amorphous silicon layer having different film qualities from each other includes depositing the first amorphous silicon layer while providing a first gas and depositing the second amorphous silicon layer while providing a second gas,
the first gas includes argon gas, and
the second gas includes hydrogen gas.
6. The method as claimed in claim 5 , wherein the first polycrystalline silicon layer and the second polycrystalline silicon layer include silicide formed by bonding of the metal catalyst and silicon, and the first polycrystalline silicon layer has a higher silicide content than the second polycrystalline silicon layer.