Method for providing a conductive material structure on a carrier

1. A method for providing a conductive material structure on a carrier comprising:

applying a photo sensitive material on the carrier;

applying a mask on said photo sensitive material, the mask defining a conductive material structure to be formed on the carrier;

irradiating the defined structure on the carrier in order to prepare for metallization;

metalizing the defined structure for forming the conductive material structure;

covering the formed conductive material structure with an environmental protection layer except for in a set of pre-specified areas, where said set of pre-specified areas includes at least one contact area on the conductive material structure; and

placing electrical contact enhancing material on said contact area, which placing of electrical contact enhancing material is performed after the conductive material structure has been covered with the environmental protection layer;

wherein:

the carrier comprises a dielectric substrate;

applying a photo sensitive material on the carrier comprises pad or screen printing said photo sensitive material directly on the dielectric substrate; and

applying a mask on said photo sensitive material comprises selectively pad or screen printing said mask on said photo sensitive material.

2. The method according to claim 1 , wherein irradiating involves UV light.

3. The method according to claim 1 , wherein the photo sensitive material includes a polymer, which a reagent after irradiation binds to the carrier, said polymer having fiber strands on which metal will attach.

4. The method according to claim 1 , further comprising removing residual material from the carrier after it has been irradiated.

5. The method according to claim 1 , further comprising drying the mask and/or the photo sensitive layer before irradiating.

6. The method according to claim 1 , wherein placing electrical contact enhancing material comprises plating electrical contact enhancing material onto said contact area while using the environmental protection layer as a mask.

7. The method according to claim 1 , wherein covering the conductive material structure with an environmental protection layer comprises applying the environmental protection layer on a side of the conductive material structure that faces away from the carrier.

8. The method according to claim 1 , wherein the conductive material structure defines at least one antenna radiator.

9. The method according to claim 1 , wherein

the dielectric substrate of the carrier and the conductive material structure have a three-dimensional extension.

10. The method according to claim 1 , wherein the carrier is a mounting entity for being mounted in a piece of electronic equipment and the conductive material structure is provided on at least one exterior surface of said mounting entity.

11. The method according to claim 10 , wherein said piece of electronic equipment is a portable electronic device.

12. The method according to claim 11 , wherein the portable electronic device is a portable radio communication device.

13. The method according to claim 12 , wherein the portable radio communication device is a cellular phone.

14. A method for providing a conductive material structure on a carrier comprising:

applying a photo sensitive material on the carrier;

applying a mask on said photo sensitive material, the mask defining a conductive material structure to be formed on the carrier;

irradiating the defined structure on the carrier in order to prepare for metallization;

metalizing the defined structure for forming the conductive material structure;

covering the formed conductive material structure with an environmental protection layer except for in a set of pre-specified areas, where said set of pre-specified areas includes at least one contact area on the conductive material structure; and

placing electrical contact enhancing material on said contact area, which placing of electrical contact enhancing material is performed after the conductive material structure has been covered with the environmental protection layer;

wherein applying a mask comprises printing the mask, and

wherein the printing is pad printing.

15. The method according to claim 14 , wherein:

the carrier comprises a dielectric substrate;

applying a photo sensitive material on the carrier comprises pad or screen printing said photo sensitive material directly on the dielectric substrate; and

applying a mask on said photo sensitive material comprises selectively pad or screen printing said mask on said photo sensitive material.

16. A method for providing a conductive material structure on a carrier comprising:

applying a photo sensitive material on the carrier;

applying a mask on said photo sensitive material, the mask defining a conductive material structure to be formed on the carrier;

irradiating the defined structure on the carrier in order to prepare for metallization;

metalizing the defined structure for forming the conductive material structure;

wherein the carrier comprises a dielectric substrate;

wherein the dielectric substrate of the carrier and the conductive material structure have a three-dimensional extension; and

wherein the conductive material structure is provided on a curved surface of the dielectric substrate of the carrier.

17. The method of claim 16 , wherein:

applying a photo sensitive material on the carrier comprises pad or screen printing said photo sensitive material directly on the dielectric substrate of the carrier; and

applying a mask on said photo sensitive material comprises selectively pad or screen printing the mask directly on said photo sensitive material.

18. A method for providing a conductive material structure on a carrier comprising:

applying a photo sensitive material on the carrier by printing said photo sensitive material on the carrier;

applying a mask on said photo sensitive material by printing said mask on said photo sensitive material, the mask defining a conductive material structure to be formed on the carrier;

irradiating the defined structure on the carrier in order to prepare for metallization; and

metalizing the defined structure for forming the conductive material structure;

wherein the carrier and the conductive material structure extend in three dimensions;

wherein the carrier comprises a dielectric substrate; and

wherein the conductive material structure is provided on a curved surface of the dielectric substrate of the carrier, or wherein the conductive material structure is provided on two planar surfaces of the dielectric substrate of the carrier that intersect at an acute, obtuse, or right angle to each other; and

wherein:

printing said photo sensitive material on the carrier comprises pad printing said photo sensitive material directly on the dielectric substrate of the carrier; and

printing said mask on said photo sensitive material comprises pad printing the mask directly on said photo sensitive material.