Rogowski coil assemblies and methods for providing the same
View Patent ↗Rogowski coil assemblies and methods for providing or forming Rogowski coil assemblies are provided. A Rogowski coil assembly may include a printed circuit board and a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces. The circuit traces may retain and connect the plurality of Rogowski coil sections.
1. A Rogowski coil assembly, comprising:
a printed circuit board;
a plurality of Rogowski coil sections mounted to an external surface of the printed circuit board by one or more respective circuit traces, wherein the circuit traces secure each end of the plurality of Rogowski coil sections preventing the coils sections from unwinding, connect the plurality of Rogowski coil sections, and to form a return current path, wherein the return current path is formed on a surface of the printed circuit board opposite a surface on which the Rogowski coil sections are mounted;
a substantially circular opening within the printed circuit board configured to receive at least one conductor that is monitored by the plurality of Rogowski coil sections; and
a continuous gap in the printed circuit board connecting the opening and an edge of the printed circuit board, wherein a gap diameter of the continuous gap is substantially smaller than an opening diameter of the opening.
2. The Rogowski coil assembly of claim 1 , wherein each of the plurality of Rogowski coil sections is positioned an approximately equal distance from the opening.
3. The Rogowski coil assembly of claim 1 , wherein the plurality of Rogowski coil sections are positioned around the opening.
4. The Rogowski coil assembly of claim 1 , further comprising:
a capacitive shielding positioned within the opening between the printed circuit board and the at least one conductor.
5. The Rogowski coil assembly of claim 1 , further comprising:
at least one connector attached to the printed circuit board and configured to provide measurements data collected by the plurality of Rogowski coil sections to an external measurements processing circuit.
6. The Rogowski coil assembly of claim 1 , further comprising:
a measurements processing circuit attached to the printed circuit board and configured to receive measurements data collected by the plurality of Rogowski coil sections and process the received measurements data.
7. The Rogowski coil assembly of claim 1 , wherein the plurality of Rogowski coil sections comprise approximately three to approximately twelve Rogowski coil sections.
8. The Rogowski coil assembly of claim 1 , wherein the return current path for the plurality of Rogowski coil sections comprises one of (i) a circuit trace on the printed circuit board or (ii) a conductor that passes through the plurality of Rogowski coil sections.