Printhead assembly with molded ink manifold having polymer coating

1. A printhead assembly comprising:

a molded ink manifold having a plurality of ink outlets defined in a manifold bonding surface;

one or more printhead integrated circuits bonded to the manifold bonding surface,

wherein at least said manifold bonding surface comprises a polymer coating, said polymer coating plugging fissures in said molded ink manifold.

2. The printhead assembly of claim 1 , wherein said fissures are unwanted fissures resulting from a molding process used to fabricate said ink manifold.

3. The printhead assembly of claim 1 , wherein said manifold bonding surface is substantially planar as a result of said polymer coating plugging said fissures.

4. The printhead assembly of claim 1 , wherein the entire molded ink manifold is coated with said polymer coating.

5. The printhead assembly of claim 1 , wherein said polymer coating is selected from the group of polymers consisting of: polyimides, polyesters, epoxies, polyolefins, siloxanes and liquid crystal polymers.

6. The printhead assembly of claim 1 , wherein said polymer coating comprises inorganic or organic additives for providing one or more of the following characteristics: wettability, adhesive bond strength, and scratch-resistance.

7. The printhead assembly of claim 1 , wherein said polymer coating is applied to said molded ink manifold by dipping, spray coating or spin coating.

8. The printhead assembly of claim 1 comprising a plurality of printhead integrated circuits butted end on end along a longitudinal extent of said ink supply manifold.

9. The printhead assembly of claim 8 , wherein said plurality of printhead integrated circuits define a pagewidth printhead.

10. The printhead assembly of claim 1 , wherein said printhead integrated circuits are bonded to the manifold bonding surface via an adhesive film.