IP Library Granted Patent US 8,521,320
Granted Patent B2
US 8,521,320 · App. 13/214,220 · Granted Aug 27, 2013

Printing system for cured 3D structures

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Quick Facts
Patent No.
US 8,521,320
App. No.
13/214,220
Granted
Aug 27, 2013
Kind
B2
Abstract

A printing system is provided having at least one printhead for printing material to create a printed product, and an object incorporation device that incorporates inorganic semiconductors into the product being printed while the at least one printhead prints the product.

Claims (10)

1. A printing system comprising:

at least one printhead for printing material to create a printed product, and

an object incorporation device that incorporates inorganic semiconductors into the product being printed whilst the at least one printhead prints the product.

2. A system as claimed in claim 1 wherein the inorganic semiconductor comprises silicon.

3. A system as claimed in claim 1 wherein the inorganic semiconductor comprises a Group III-V semiconductor.

4. A system as claimed in claim 1 wherein the system includes a plurality of printheads.

5. A system as claimed in claim 1 executing a process, the system comprising a plurality of subsystems, each subsystem being configured to perform one of a first subset of N 1 of the stages, where N is greater than 1 and to change the stage of the subset being performed on receipt of a change instruction;

wherein, in the event that one of the subsystems fails, at least one of the remaining subsystems synchronously changes to performing the respective stage of the failed subsystem without requiring transfer of data relating the respective stage to the said at least one remaining subsystems, and

when a subsystem changes to performing a different stage, the system reconfigures the subsystem to be capable of performing a second subset N 2 of the stages where N 1 and N 2 have the same number of stages.

6. A system as claimed in claim 1 wherein the printhead prints electrical connections to at least one object incorporated in the products.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2014
From: SILVERBROOK RESEARCH PTY LTD
To: 3D SYSTEMS, INC.
Reel/Frame 033212/0488 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 21, 2011
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 026792/0342 →