IP Library Granted Patent US 8,549,914
Granted Patent B2
US 8,549,914 · App. 13/218,770 · Granted Oct 8, 2013

Sensor structure

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Quick Facts
Patent No.
US 8,549,914
App. No.
13/218,770
Granted
Oct 8, 2013
Kind
B2
Abstract

Provided is a sensor structure capable of improving the reliability of connecting parts of electronic components and achieving excellent productivity and reduction in size and weight, for example, when electronic components are externally mounted on input/output terminals of a sensor. A relationship between a linear expansion coefficient for a housing serving as a base of a structure and a linear expansion coefficient of a resin material for a sensor casing of a sensor to be mounted is set to satisfy “sensor casing<linear expansion coefficient α<housing”. When electronic components are externally mounted, the electric components are mounted on input/output terminals which are integrally formed on the side of a component having a small linear expansion coefficient, i.e., on the side of the sensor casing.

Claims (15)

1. A sensor structure comprising:

a housing made of a first resin and including a connector for inputting and outputting a signal to and from an outside;

a sensor for detecting a first physical quantity; and

a sensor for detecting a second physical quantity, the sensors being mounted in the housing, wherein

the sensor for detecting the second physical quantity is integrally formed with a sensor casing made of a second resin in such a manner that a plurality of input/output terminals electrically connected to the connector project from the sensor casing,

the second resin has a linear expansion coefficient smaller than a linear expansion coefficient of the first resin,

a chip-shaped electronic component external from the sensor casing is electrically connected to bridge the plurality of input/output terminals of the sensor casing, and

the housing includes a space to be filled with a cast resin, the space being located beneath a junction between the chip-shaped electronic component and the input/output terminals.

2. The sensor structure according to claim 1 , wherein

the entirety of the input/output terminals and electronic component is covered by the cast resin, and

the housing and the sensor for detecting the second physical quantity are integrally fixed to each other by a filling material.

3. The sensor structure according to claim 1 , wherein the first physical quantity is an air flow and the second physical quantity is a pressure.

4. The sensor structure according to claim 1 , wherein two or more electronic components are electrically connected to the input/output terminals, and the two or more electronic components are mounted in a staggered manner.

5. The sensor structure according to claim 1 , wherein the electronic component is mounted in the vicinity of an area where the input/output terminal protrudes from the sensor casing.

6. The sensor structure according to claim 5 , wherein assuming that a width of one of the input/output terminals is represented by W, a distance from a junction between the input/output terminal and the connector to the electronic component is 2W or more.

Assignments (2)
CHANGE OF NAME Recorded Mar 25, 2021
From: HITACHI AUTOMOTIVE SYSTEMS, LTD.
To: HITACHI ASTEMO, LTD.
Reel/Frame 056299/0447 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2011
From: SAITO, TAKAYUKI; KOBAYASHI, CHIHIRO
To: HITACHI AUTOMOTIVE SYSTEMS, LTD.
Reel/Frame 027004/0140 →