IP Library Granted Patent US 8,476,727
Granted Patent B2
US 8,476,727 · App. 13/218,937 · Granted Jul 2, 2013

Materials, systems and methods for optoelectronic devices

Inventors: Hui Tian (Cupertino, CA); Edward Sargent (Toronto, CA)
Assignee: InVisage Technologies, Inc.
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Quick Facts
Patent No.
US 8,476,727
App. No.
13/218,937
Granted
Jul 2, 2013
Kind
B2
Abstract

A photodetector is described along with corresponding materials, systems, and methods. The photodetector comprises an integrated circuit and at least two optically sensitive layers. A first optically sensitive layer is over at least a portion of the integrated circuit, and a second optically sensitive layer is over the first optically sensitive layer. Each optically sensitive layer is interposed between two electrodes. The two electrodes include a respective first electrode and a respective second electrode. The integrated circuit selectively applies a bias to the electrodes and reads signals from the optically sensitive layers. The signal is related to the number of photons received by the respective optically sensitive layer.

Claims (32)

1. A photodetector comprising:

a semiconductor substrate;

a photosensor array having a plurality of pixel regions, the pixel regions arranged into a plurality of rows and a plurality of columns, each of the plurality of pixel regions comprising at least one optically sensitive material over a portion of the semiconductor substrate;

pixel circuitry formed on the semiconductor substrate for each of the plurality of respective pixel regions, the pixel circuitry for each respective pixel region being configured to apply a voltage difference across the optically sensitive material for the respective pixel region and to read out a signal based on a flow of current through the optically sensitive material over a period of time with at least a portion of the pixel circuitry for a first respective pixel region formed under the optically sensitive material being configured for a different respective pixel region that is not read out by the pixel circuitry for the first respective pixel region;

first pixel circuitry for the first respective pixel region being formed in a first half of a first region of the semiconductor substrate and a first half of a second region of the semiconductor substrate; and

second pixel circuitry for a second respective pixel region being formed in a second half of the first region of the semiconductor substrate and a second half of the second region of the semiconductor substrate.

2. The photodetector of claim 1 , wherein the pixel circuitry for the first respective pixel region includes a plurality of circuit elements, wherein at least one circuit element is formed under both the optically sensitive material for the first respective pixel region and optically sensitive material for the different respective pixel region.

3. The photodetector of claim 1 , wherein the first region forms a first rectangular region on the semiconductor substrate and the second region forms a second rectangular region on the semiconductor substrate, wherein a first size of the first region and a first size of the second region are related by a first aspect ratio.

4. The photodetector of claim 3 , wherein the first aspect ratio is 1:1.

5. The photodetector of claim 3 , wherein the first aspect ratio is 2:3.

6. The photodetector of claim 3 , wherein the first aspect ratio is 3:4.

7. The photodetector of claim 3 , wherein the first pixel circuitry is substantially contained in a third rectangular region and the second pixel circuitry is substantially contained in a fourth rectangular region, wherein a third size of the third rectangular region and a fourth size of the fourth rectangular region are related by a second aspect ratio.

8. The photodetector of claim 7 , wherein the second aspect ratio is higher than the first aspect ratio.

9. The photodetector of claim 7 , wherein the second aspect ratio is more than two times the first aspect ratio.

10. A photodetector comprising:

a semiconductor substrate;

a photosensor array having a plurality of pixel regions, the pixel regions arranged into a plurality of rows and a plurality of columns, each of the plurality of pixel regions comprising at least one optically sensitive material over a portion of the semiconductor substrate;

pixel circuitry formed on the semiconductor substrate for each of the plurality of respective pixel regions, the pixel circuitry for each respective pixel region being configured to apply a voltage difference across the optically sensitive material for the respective pixel region and to read out a signal based on a level of light intensity absorbed by the optically sensitive layer for the respective pixel region; and with at least a portion of the pixel circuitry for a first respective pixel region formed under the optically sensitive material being configured for a different respective pixel region that is not read out by the pixel circuitry for the first respective pixel region;

first pixel circuitry for the first respective pixel region being formed in a first half of a first region of the semiconductor substrate and a first half of a second region of the semiconductor substrate; and

second pixel circuitry for a second respective pixel region being formed in a second half of the first region of the semiconductor substrate and a second half of the second region of the semiconductor substrate.

11. A photodetector comprising:

a semiconductor substrate;

a photosensor array having a plurality of pixel regions, the pixel regions arranged into a plurality of rows and a plurality of columns and including at least a first pixel region adjacent to a second pixel region;

each pixel region comprising at least one optically sensitive material over a portion of the semiconductor substrate, wherein the optically sensitive material for the first pixel region is over a first portion of the semiconductor substrate and the sensitive material for the second pixel region is over a second portion of the semiconductor substrate; and

pixel circuitry formed on the semiconductor substrate for each of the respective pixel regions, the pixel circuitry for each respective pixel region configured to apply a voltage difference across the optically sensitive material for the respective pixel region and to read out a signal based on a flow of current through the optically sensitive material over a period of time;

wherein the pixel circuitry for the first pixel region extends from the first portion of the semiconductor substrate to the second portion of the semiconductor substrate and the pixel circuitry for the second pixel region extends from the second portion of the semiconductor substrate to the first portion of the semiconductor substrate.

12. A photodetector comprising:

a semiconductor substrate;

a photosensor array having a plurality of pixel regions, the pixel regions arranged into a plurality of rows and a plurality of columns and including at least a first pixel region adjacent to a second pixel region;

each pixel region comprising at least one optically sensitive material over a portion of the semiconductor substrate, wherein the optically sensitive material for the first pixel region is over a first portion of the semiconductor substrate and the sensitive material for the second pixel region is over a second portion of the semiconductor substrate; and

pixel circuitry formed on the semiconductor substrate for each of the respective pixel regions, the pixel circuitry for each respective pixel region configured to apply a voltage difference across the optically sensitive material for the respective pixel region and to read out a signal based on a level of light intensity absorbed by the optically sensitive layer for the respective pixel region;

wherein the pixel circuitry for the first pixel region extends from the first portion of the semiconductor substrate to the second portion of the semiconductor substrate and the pixel circuitry for the second pixel region extends from the second portion of the semiconductor substrate to the first portion of the semiconductor substrate.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 13, 2017
From: TIAN, HUI; SARGENT, EDWARD HARTLEY
To: INVISAGE TECHNOLOGIES, INC.
Reel/Frame 042692/0911 →
RELEASE OF SECURITY INTEREST Recorded Mar 20, 2017
From: PACIFIC WESTERN BANK, AS SUCCESSOR IN INTEREST TO SQUARE 1 BANK
To: INVISAGE TECHNOLOGIES, INC.
Reel/Frame 041652/0945 →
RELEASE OF SECURITY INTEREST Recorded Mar 16, 2017
From: HORIZON TECHNOLOGY FINANCE CORPORATION
To: INVISAGE TECHNOLOGIES, INC.
Reel/Frame 042024/0887 →
SECURITY INTEREST Recorded Jul 21, 2015
From: INVISAGE TECHNOLOGIES, INC.
To: HORIZON TECHNOLOGY FINANCE CORPORATION
Reel/Frame 036148/0467 →
RELEASE OF SECURITY INTEREST Recorded Oct 2, 2014
From: TRIPLEPOINT CAPITAL LLC
To: INVISAGE TECHNOLOGIES, INC.
Reel/Frame 033886/0632 →
RELEASE OF SECURITY INTEREST Recorded Sep 5, 2013
From: TRIPLEPOINT CAPITAL LLC
To: INVISAGE TECHNOLOGIES, INC.
Reel/Frame 031163/0810 →
SECURITY AGREEMENT Recorded Sep 3, 2013
From: INVISAGE TECHNOLOGIES, INC.
To: SQUARE 1 BANK
Reel/Frame 031160/0411 →
SECURITY AGREEMENT Recorded Jan 4, 2012
From: INVISAGE TECHNOLOGIES, INC.
To: TRIPLEPOINT CAPITAL LLC
Reel/Frame 027479/0419 →
Continuity (11)
Continuation 13209264 · Aug 12, 2011
Continuation 12728181 · Mar 19, 2010
Continuation 12106256 · Apr 18, 2008
Provisional Application 60912581 · Apr 18, 2007
Provisional Application 60958846 · Jul 9, 2007
Provisional Application 60970211 · Sep 5, 2007
Provisional Application 61026440 · Feb 5, 2008
Provisional Application 61026650 · Feb 6, 2008
Provisional Application 61028481 · Feb 13, 2008
Provisional Application 61046379 · Apr 18, 2008
Related Publication 20120056076A1 · Mar 8, 2012