METHODS AND SYSTEM FOR EFFECTIVELY REMOVING HEAT FROM A WIRELESS BASE STATION
Various embodiments of systems and methods are presented for effectively removing heat from electrical and electrical-mechanical devices which include relatively high-power Radio-Frequency (RF) components. Improved structure enhances the shielding of components from unwanted and potentially damaging over-heating. Improved structure also enhances the effectiveness by which heat is thermally dissipated by air convection.
1 . A wireless Base Station (BS) system operative to effectively remove heat from high-power Radio-Frequency (RF) components belonging to said system, comprising:
a first mechanical enclosure operative to environmentally seal a first set of electrical components; and
a second mechanical enclosure operative to environmentally seal a second set of electrical components comprising at least one high-power RF component, the second mechanical enclosure mechanically attach to the first mechanical enclosure such that an air-pathway is formed between the first sealed mechanical enclosure and the second sealed mechanical enclosure;
wherein the air-pathway is operative to convectively remove heat generated by the at least one high-power RF component, as air not sealed inside the two mechanical enclosures enters the air-pathway from a first location outside the wireless BS system, the air then absorbs heat from the second mechanical enclosure heated by the at least one high-power RF component, and the heated air then exits the air-pathway from a second location outside the wireless BS system.
2 . The system of claim 1 , wherein the air-pathway operative to shield the first set of electrical component from heat generated by the at least one high-power RF component.
3 . The system of claim 2 , wherein the first location has lower elevation than the second location, thereby creating a “chimney effect” as the air enters and exits the air-pathway.
4 . The system of claim 2 , wherein the air-pathway is operative to convectively remove heat generated by the first set of electrical component, as air not sealed inside the two mechanical enclosures enters the air-pathway from the first location outside the wireless BS system, the air then absorbs heat from the first mechanical enclosure heated by the first set of electrical components, and the heated air then exits the air-pathway from the second location outside the wireless BS system.
5 . The system of claim 2 , wherein:
the first set of electrical components are capable of operating at a first maximum ambient temperature;
the second set of electrical components are capable of operating at a second maximum ambient temperature that is higher than the first maximum ambient temperature;
heat generated by the first set of electrical components results in a first ambient temperature that is equal to at most the first maximum ambient temperature;
heat generated by the second set of electrical components results in a second ambient temperature that is equal to at most the second maximum ambient temperature, but is higher than the first maximum ambient temperature; and
an ambient temperature difference between the second ambient temperature and the first ambient temperature is maintained by the air-pathway acting as a thermal insulator between the first mechanical enclosure and the second mechanical enclosure.
6 . The system of claim 5 , wherein a thermal insulator sheet inside the air-pathway is used to further shield the first set of electrical components from heat generated by the at least one high-power RF component
7 . The system of claim 2 , wherein the first set of electrical components comprises digital electrical components, and the air-pathway shields the digital electrical components from heat generated by the at least one high-power RF component, which is more temperature resistant than the digital electrical components.
8 . The system of claim 7 , wherein the at least one high-power RF component comprises at least one RF Power Amplifier, and the at least one RF Power Amplifier dissipates more electrical power than the digital electrical components.
9 . The system of claim 7 , wherein the at least one high-power RF component comprises a plurality of RF Power Amplifiers, driving a plurality of antennas extending from the second mechanical enclosure.
10 . The system of claim 2 , wherein the air-pathway operative to substantially reduce a contact area through which the two mechanical enclosures attach, thereby substantially reducing heat flow between the two mechanical enclosures.
11 . The system of claim 10 , wherein the contact area is located substantially away from the at least one high-power RF component, thereby further reducing heat flow between the two mechanical enclosures.
12 . The system of claim 10 , wherein the contact area comprises at least one connector through which electrical wiring connect at least some of the first set of electrical components with at least some of the second set of electrical components, thereby allowing the wireless BS to operate as an integrated wireless electrical system.
13 . The system of claim 12 , wherein the at least one connector is operative to preserve environmental seal of the first mechanical enclosure and the second mechanical enclosure.
14 . The system of claim 1 , wherein the second mechanical enclosure comprises a first set of heat radiating fins protruding into the air-pathway, and the first set of heat radiating fins operative to increase contact area between the second mechanical enclosure and the air-pathway, thereby improving heat flow.
15 . The system of claim 14 , wherein the second mechanical enclosure comprises a second set of heat radiating fins operative to conduct heat from the second mechanical enclosure to free air surrounding the wireless BS, and the first mechanical enclosure comprises an additional set of heat radiating fins operative to conduct heat from the first mechanical enclosure to free air surrounding the wireless BS.
16 . The system of claim 15 , wherein the first set of heat radiating fins together with the air-pathway together with the second set of heat radiating fins together with the additional set of heat radiating fins are operative to remove heat at a rate comparable to heat removed by larger systems not having the first set of heat radiating fins and the air-pathway.
17 . A method for effectively removing heat from high-power Radio-Frequency (RF) components belonging to a wireless Base Station (BS), comprising:
operating a first set of electrical components inside a first sealed environment of a first mechanical enclosure belonging to the wireless BS;
operating a second set of electrical components inside a second sealed environment of a second mechanical enclosure belonging to the wireless BS, wherein the second set of electrical components comprises at least one high-power RF component, and the second mechanical enclosure attach to the first mechanical enclosure via at least one contact area;
letting air from outside the wireless BS enter from a first location into an air-pathway formed between the two attached sealed mechanical enclosures;
letting the air absorb heat from the second mechanical enclosure heated by the at least one high-power RF component, as the air rises inside the air-pathway; and
letting the heated air exit the air-pathway into a second location, thereby removing heat from the at least one high-power RF component and the wireless BS.
18 . The method of claim 17 , further comprising letting the air-pathway shield the first set of electrical components from heat generated by the at least one high-power RF component.
19 . A method for effectively shielding digital electrical components from heat generated by high-power Radio-Frequency (RF) components belonging to a wireless Base Station (BS), comprising:
operating digital electrical components inside a first sealed environment of a first mechanical enclosure belonging to the wireless BS;
operating at least one high-power RF component inside a second sealed environment of a second mechanical enclosure belonging to the wireless BS, wherein the second mechanical enclosure attach to the first mechanical enclosure via at least one contact area; and
letting an air-pathway formed between the two attached mechanical enclosures shield the first set of electrical components from heat generated by the at least one high-power RF component.
20 . The method of claim 19 , further comprising:
letting air from outside the wireless BS enter from a first location into the air-pathway;
letting the air absorb heat from the second mechanical enclosure heated by the at least one high-power RF component, as the air rises inside the air-pathway; and
letting the heated air exit the air-pathway into a second location, thereby removing heat from the at least one high-power RF component and the wireless BS.