Circuit board with even current distribution
View Patent ↗A circuit board includes an outer conductive layer, a number of inner conductive layers, at least one group of vias defined through the outer conductive layer and the inner conductive layers and electrically connected each conductive layers, at least one power supply element, and at least one electronic element. The at least one group of vias surrounds the at least one power supply element. When the least one power supply element outputs current to the at least one electronic element, a first portion of the output current flows to the inner conductive layers through the group of vias surrounding the at least one power supply element to be input to the at least one electronic element, and a second portion of the output current flows into the at least one electronic element through the outer conductive layer.
1. A circuit board, comprising:
an outer conductive layer;
a plurality of inner conductive layers;
at least one group of vias defined through the outer conductive layer and the inner conductive layers and each via electrically connecting the outer conductive layer to each conductive layer;
at least one power supply element corresponding to the at least one group of vias; and
at least one electronic element; wherein the at least one group of vias surrounds the at least one power supply element, when the least one power supply element outputs current to the at least one electronic element, a first portion of the output current flows to each inner conductive layer through the group of vias surrounding the at least one power supply element to be input to the at least one electronic element, and a second portion of the output current flows into the at least one electronic element through the outer conductive layer.
2. The circuit board of claim 1 , wherein the group of vias surrounding the at least one power supply element forms a current flowing region, the current is output into current flowing region and then provided to the at least one electronic element.
3. The circuit board of claim 1 , wherein the number of each group vias are determined according to a value of the current output from the at least one power supply element and a maximum value of the current flowing through each via.
4. The circuit board of claim 1 , further comprising a plurality of element holes defined in the conductive layers corresponding to the at least one electronic element, wherein the at least one electronic element is electrically connected to the conductive layers by the component holes.
5. The circuit board of claim 4 , wherein the first portion of the current flowing through the inner conductive layers, and the second portion of the current flowing through outer conductive layer is converged at the component holes on the outer conductive layer and input into the electronic element through the outer conductive layer.
6. The circuit board of claim 1 , wherein the current flowing region is rectangular.
7. The circuit board of claim 1 , wherein the conductive layers are signal layers or power supply layers.
8. The circuit board of claim 1 , wherein the conductive layers are copper foil layers.
9. The circuit board of claim 1 , wherein the at least one electronic element is a processor.