IP Library Granted Patent US 8,421,109
Granted Patent B2
US 8,421,109 · App. 13/222,739 · Granted Apr 16, 2013

Light-emitting apparatus package, light-emitting apparatus, backlight apparatus, and display apparatus

Inventor: Tsukasa Inoguchi (Nara, JP)
Assignee: Sharp Kabushiki Kaisha
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Quick Facts
Patent No.
US 8,421,109
App. No.
13/222,739
Granted
Apr 16, 2013
Kind
B2
Abstract

A light-emitting apparatus package of the present invention includes (i) an electrically insulated ceramic substrate, (ii) a first concave section formed in the direction of thickness of the ceramic substrate so as to form a light exit aperture in a surface of the ceramic substrate, (iii) a second concave section formed within the first concave section in the further direction of thickness of the ceramic substrate so that one or more light-emitting devices are provided therein, (iv) a wiring pattern for supplying electricity, which is provided in the first concave section, and (v) a metalized layer having light-reflectivity, which is (a) provided between the light-emitting device and the surface of the second concave section of the substrate, and (b) electrically insulated from the wiring pattern. On the account of this, the light-emitting apparatus package in which heat is excellently discharged and light is efficiently utilized and a light-emitting apparatus in which the light-emitting apparatus package is used can be obtained.

Claims (33)

1. A light-emitting apparatus, comprising:

a light-emitting device;

a ceramic package including

a first concave section, and

a second concave section located in the first concave section, for providing an area for mounting said light-emitting device;

a conductive pattern formed on the area of the second concave section and connected to a bottom electrode of said light-emitting device;

a conductive layer formed on the first concave section other than the second concave section;

a first wire connected between said conductive layer and a top electrode of said light-emitting device; and

a metal layer formed below said conductive pattern and buried in said ceramic package.

2. A light-emitting apparatus of claim 1 , further comprising:

a diode with a bottom electrode thereof connected to said conductive pattern; and

a second wire connected between said conductive layer and a top electrode of said diode.

3. A light-emitting apparatus of claim 2 , wherein said diode is a light-emitting diode.

4. A light-emitting apparatus of claim 2 , wherein said first wire is connected to a pattern of said conductive layer and said second wire is connected to another pattern of said conductive layer.

5. A light-emitting apparatus of claim 2 , wherein the bottom electrode of said light-emitting device is connected to said conductive pattern with a conductive adhesive agent.

6. A light-emitting apparatus of claim 5 , wherein said metal layer includes a wiring pattern.

7. A light-emitting apparatus of claim 6 , wherein said ceramic package contains aluminum nitride.

8. A light-emitting apparatus of claim 7 , wherein the first and second concave sections are sealed with a transparent resin.

9. A light-emitting apparatus, comprising:

a light-emitting device;

a ceramic package including

a first concave section, and

a second concave section located in the first concave section, for providing an area for mounting said light-emitting device;

a conductive pattern formed on the area of the second concave section and connected to a bottom electrode of said light-emitting device;

a conductive layer formed on the first concave section other than the second concave section;

a first wire connected between said conductive layer and a top electrode of said light-emitting device;

a diode with a bottom electrode thereof connected to said conductive pattern; and

a second wire connected between said conductive layer and a top electrode of said diode.

10. A light-emitting apparatus of claim 9 , wherein said diode is a light-emitting diode.

11. A light-emitting apparatus of claim 9 , wherein said first wire is connected to a pattern of said conductive layer and said second wire is connected to another pattern of said conductive layer.

12. A light-emitting apparatus of claim 9 , wherein both the bottom electrodes of said diode is connected to said conductive pattern with a conductive adhesive agent.

13. A light-emitting apparatus of claim 12 , wherein said ceramic package contains aluminum nitride.

14. A light-emitting apparatus of claim 13 , wherein the first and second concave sections are sealed with a transparent resin.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 26, 2018
From: SHARP KABUSHIKI KAISHA
To: XIAMEN SAN'AN OPTOELECTRONICS CO., LTD.
Reel/Frame 047331/0728 →
Priority Claims (2)
JP 2003/098554 · Apr 1, 2003 · national
JP 2003/104669 · Apr 8, 2003 · national
Continuity (3)
Division 12540220 · Aug 12, 2009
Division 10816736 · Apr 1, 2004
Related Publication 20110309406A1 · Dec 22, 2011