Method of producing liquid ejection head
Disclosed is a method of including the steps of preparing a substrate having a flow-path-wall member; bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as the ejection port member such that spaces serving as the flow paths are provided between the substrate and the photo-curing resin; providing through-holes in the resin layer such that the spaces communicate with the outside air; exposing part of the resin layer to light to form an exposed portion and an unexposed portion; heating the exposed portion of the resin layer; and removing the unexposed portion from the heated resin layer to form the ejection ports, removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member.
1. A method of producing a liquid ejection head including an ejection port member having ejection ports through which liquid is ejected, and a flow-path-wall member having inner walls of liquid flow paths through which liquid is supplied to the ejection ports, the method comprising, in sequence, the steps of:
preparing a substrate having the flow-path-wall member on or above the substrate;
bonding the flow-path-wall member to a resin layer that is composed of a photo-curing resin and serves as the ejection port member such that spaces serving as the flow paths are provided between the substrate and the photo-curing resin;
providing through-holes in the resin layer such that the spaces communicate with the outside air;
exposing part of the resin layer to light to form an exposed portion and an unexposed portion;
heating the exposed portion of the resin layer; and
removing the unexposed portion from the heated resin layer to form the ejection ports, thereby forming the ejection port member.
2. The method according to claim 1 , wherein a liquid supply port communicating with the flow paths is provided in the substrate so as to penetrate through the substrate and so as to communicate with the spaces, after the through-holes are formed.
3. The method according to claim 1 , wherein the resin layer is irradiated with laser light to provide the through-holes.
4. The method according to claim 1 , wherein liquid energy generating elements configured to generate energy for ejection are provided on the surface of the substrate, and wherein the ejection ports and the through-holes are provided in the resin layer, at portions facing the energy generating elements.
5. The method according to claim 3 , wherein the resin layer is supported by a base film, is bonded to the flow-path-wall member, is irradiated with the laser light together with the base film so that the through-holes are provided in the resin layer, and then the base film is removed.
6. The method according to claim 1 , wherein the resin layer having the through-holes is exposed such that portions surrounding the through-holes are left unexposed.
7. The method according to claim 1 , wherein the step of preparing the substrate includes the substeps of:
applying a material of the flow-path-wall member to the substrate; and
forming the flow-path-wall member from the material.
8. The method according to claim 1 , wherein the liquid ejection head is an ink jet recording head configured to form a recording image on a recording medium using ink as ejecting liquid, and wherein the through-holes are provided in the resin layer, at portions facing the energy generating elements that do not contribute to formation of the recording image.