Metal plating compositions and methods
Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.
1. A method comprises:
a) providing a metal plating composition comprising one or more sources of metal ions and one or more compounds having a formula:
H-A′ p -Q-[C(O)—CH 2 O—((R 1 CH) t —O) z —CH 2 —C(O)—NH-A] u —H (I)
where A′ is —(NH—(CH 2 ) x′) y ′—; —NH(CH 2 ) x ′(O—(CHR 1 ) r ′) w ′—O—(CH 2 ) x ′—; or —NH—((R 1 CH) r ′—O) w ′—C 2 H 4—,
A is—((CH 2 ) x—NH) y —; —(CH 2 ) x —(O—(CHR 1 ) r )w—O—(CH 2 ) x —NH—; or —((R 1 CH) r —O) w —C 2 H 4 —NH—,
R 1 is —H or —CH 3 ,
Q is -NH— when p=1 or —O-when p=0,
p is 0 or 1, wherein H—and Q form a chemical bond when p =0,
r′ is an integer from 2 to 4,
w′ is an integer from 1 to 50,
x′ is an integer from 2 to 6,
y′ is an integer from 0 to 5,
wherein H-and Q form a chemical bond when y′ is 0,
r is an integer from 2 to 4,
w is an integer from 1 to 50,
x is an integer from 2 to 6,
y is an integer from 0 to 5, wherein H—is bonded to the nitrogen of terminal —C(O)—NH—when y is 0,
t is an integer from 2 to 4,
u is an integer from 1 to 20,
w is an integer from 1 to 50, and
z is an integer from 1 to 50,
b) contacting a substrate with the composition; and
c) electroplating a metal on the substrate.
2. The method of claim 1 , wherein the metal ions are chosen from copper, tin, nickel, gold, silver, palladium, platinum, indium or alloys thereof.
3. The method of claim 2 , wherein the metal ions are copper ions.
4. The method of claim 1 , wherein the substrate is an electrical device or a decorative article.
5. The method of claim 4 , wherein the electrical device is a printed wiring board.
6. The method of claim 1 , wherein the metal plating composition further comprises one or more brighteners, suppressors, surfactants, acids, brightener breakdown inhibition compounds and alkali metal salts.