IP Library Granted Patent US 9,161,722
Granted Patent B2
US 9,161,722 · App. 13/226,714 · Granted Oct 20, 2015

Technique for remanufacturing a medical sensor

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Quick Facts
Patent No.
US 9,161,722
App. No.
13/226,714
Granted
Oct 20, 2015
Kind
B2
Abstract

Remanufactured medical sensors and methods for remanufacturing used medical sensors are provided. Such a remanufactured sensor may include certain components from a used medical sensor and certain new components. For example, a remanufactured regional oximetry sensor may include a padding layer, an emitter and a pair of detectors, a flexible circuit coupled to the emitter and detectors, and a patient-contacting adhesive layer. The flexible circuit, the emitter, the first detector, the second detector, or any combination thereof, are from a used medical sensor, and the padding layer, the patient-contacting adhesive layer, or a combination thereof, are new.

Claims (14)

1. A method of remanufacturing a used medical sensor, comprising:

obtaining the used medical sensor, the used medical sensor comprising:

a used padding layer;

a used flexible circuit secured to the used padding layer and comprising a plurality of conductors disposed on a flexible substrate;

a used emitter electrically coupled to the flexible circuit and adapted to transmit light into a patient tissue;

a used first detector coupled to the used flexible circuit and configured to detect a first portion of light passing through the patient tissue;

a used second detector coupled to the used flexible circuit and configured to detect a second portion of light passing through the patient tissue; and

a used patient-contacting adhesive layer attached to the used padding layer;

removing the used patient-contacting adhesive layer from the used padding layer by trimming away a portion of the used padding layer, the used padding layer comprising a used interior foam layer disposed between the used flexible circuit and the used patient-contacting adhesive layer;

retaining a remaining portion of the used interior foam layer;

laminating a new patient-contacting adhesive layer against the remaining portion of the used interior foam layer; and

packaging a remanufactured version of the used medical sensor.

2. The method of claim 1 , comprising replacing a used memory unit disposed within a used connector of the used medical sensor with a new memory unit, wherein the new memory unit has substantially the same programming as the used medical sensor, or is configured to emulate the operation of the used memory unit.

3. The method of claim 1 , comprising coupling a used memory unit disposed within a used connector of the used medical sensor with an adapter configured to manipulate a time-out functionality of the used memory unit to enable the continued operation of the sensor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 9, 2012
From: NELLCOR PURITAN BENNETT LLC
To: COVIDIEN LP
Reel/Frame 029432/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2011
From: BESKO, DAVID P.; SANDMORE, DONALD R.
To: NELLCOR PURITAN BENNETT LLC
Reel/Frame 026980/0495 →