IP Library Patent Application 13228636
Patent Application Utility
App. No. 13/228,636 · Confirmation No. 7925

ENCAPSULATION OF A TEMPERATURE COMPENSATIONING STRUCTURE WITHIN AN OPTICAL CIRCUIT PACKAGE ENCLOSURE

Abandoned -- Failure to Respond to an Office Action View Publication ↗
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Code Description Pages PDF
2014-03-28 ABN Abandonment 2 View
2013-09-13 CTRS Requirement for Restriction/Election 8 View
2013-09-13 FWCLM Index of Claims 1 View
2013-03-14 NTC.PUB Notice of Publication 1 View
2011-09-23 WFEE Fee Worksheet (SB06) 1 View
2011-09-23 APP.FILE.REC Filing Receipt 3 View
2011-09-09 TRNA Transmittal of New Application 1 View
2011-09-09 SPEC Specification 20 View
2011-09-09 CLM Claims 6 View
2011-09-09 ABST Abstract 1 View
2011-09-09 DRW Drawings-only black and white line drawings 3 View
2011-09-09 OATH Oath or Declaration filed 4 View
2011-09-09 IDS Information Disclosure Statement (IDS) Form (SB08) 5 View
2011-09-09 WFEE Fee Worksheet (SB06) 2 View
2011-09-09 N417 Electronic Filing System Acknowledgment Receipt 3 View
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Quick Facts
App. No.
13/228,636
Filed
2011-09-09
Pub. No.
US20130064494A1
Art Unit
2883